1. Printed Circuit Board (PCB)
A PCB is the foundational structure used to connect and support electronic components, facilitating the flow of current through conductive paths.
2. Layer
Different structural layers of a PCB, including signal layers, ground layers, and power layers. Multilayer PCBs consist of multiple stacked layers.
3. Via
Holes in a PCB used to connect electrical paths between different layers, classified as through-holes, blind vias, and buried vias.
4. Etching
A chemical process used to remove unprotected copper layers to form the desired circuit pattern.
5. Photolithography
The process of transferring circuit patterns onto a PCB, typically using photoresist and exposure to light.
6. Finished Copper Thickness
Refers to the thickness of the copper layer after the PCB manufacturing is completed, usually expressed in ounces (oz).
7. Glass Transition Temperature (Tg)
The temperature at which PCB materials transition from a rigid state to a flexible state. A higher Tg value indicates more stable performance at elevated temperatures.
8. Surface Finish
The treatment process applied to the surface of a PCB to improve solderability and corrosion resistance. Common finishes include gold plating, silver plating, and OSP (Organic Solderability Preservative).
9. Solder Mask
A protective layer covering the surface of a PCB to prevent short circuits and other damage during soldering.
10. Design Rule Check (DRC)
The process of verifying that a PCB design adheres to manufacturing and functional specifications during the design phase.
11. Electrical Testing
Testing performed on a PCB to evaluate its electrical performance, ensuring circuit integrity and functionality.
12. Trace Width
The width of conductive paths on a PCB, which affects current carrying capacity and signal integrity.
13. Dielectric Layer
Non-conductive material layers used to isolate conductive layers within the PCB, influencing signal transmission and electrical performance.
14. Thermal Management
The practice of controlling the operating temperature of the PCB and its components through design and material selection to prevent overheating.
15. Short Circuit
An abnormal connection in a circuit where current flows incorrectly, potentially damaging components.
16. Overload
A condition where the current exceeds the rated capacity of a circuit or component, which may lead to failure or damage.
17. Component
Electronic elements mounted on a PCB, such as resistors, capacitors, and integrated circuits.
18. Signal Integrity
The ability to maintain signal waveform and quality during transmission, influenced by PCB design and materials.
19. Design Files
Electronic files used for PCB manufacturing, typically including Gerber files, layout diagrams, and circuit schematics.
20. Reverse Engineering
The process of extracting design information from an existing PCB, often used for analysis or duplication of circuit designs.
21. Component Packaging
Refers to the casing or packaging form used to protect and connect electronic components, such as DIP (Dual In-line Package) and SMD (Surface Mount Device).
22. Conductive Path
Copper traces or lines used to connect electrical signals on a PCB. The design of conductive paths directly affects electrical performance.
23. Copper Removal
The process of removing unwanted copper layers during PCB manufacturing to form the circuit pattern.
24. Multilayer PCB
A PCB with multiple layers, commonly used for high-density and complex circuit designs to save space and enhance performance.
25. Heat Sink
A device used for heat dissipation, typically attached to components that generate a significant amount of heat to lower operating temperatures.
26. Soldering Process
The method of connecting electronic components to a PCB, commonly including techniques such as wave soldering, reflow soldering, and hand soldering.
27. Electrical Performance
The characteristics exhibited by a PCB during electrical transmission, including signal attenuation, crosstalk, and delay.
28. Silkscreen
Printed markings and informational labels on the surface of a PCB, used to indicate component locations and connections.
29. Design File Format
File formats used to save PCB design information, with common types including Gerber, ODB++, and DXF.
30. Automated Assembly
The process of mounting and soldering electronic components using automated machinery, increasing production efficiency and accuracy.
31. Signal Layer
A layer in the PCB specifically used for transmitting electrical signals, as opposed to power layers and ground layers.
32. Insulation Material
Materials used to isolate electrical layers, affecting the electrical performance and signal transmission of the PCB.
33. Functional Testing
Testing performed on completed PCBs to verify their performance and functionality in actual applications.
34. Electromagnetic Compatibility (EMC)
Characteristics considered in PCB design to ensure that electronic devices operate correctly in electromagnetic environments without causing interference.
35. Electroless Plating
A copper plating process that does not use electric current, commonly used to fill copper in PCB holes.
36. Opening
Holes on a PCB used for connecting component pins or other conductors, typically for inserting components or connecting cables.
37. Serial Number
A unique identifier used to identify a specific PCB, facilitating tracking and management.
38. Yield Rate
The ratio of acceptable products to total production during the manufacturing process, reflecting the efficiency and quality of the production process.
39. Component Placement
The positioning and arrangement of components in PCB design, directly impacting circuit performance and assembly efficiency.
40. Mechanical Processing
The processes of cutting, drilling, and other physical treatments applied to the PCB to meet design requirements.
41. Double-Sided PCB
A printed circuit board with conductive layers on both sides, commonly used in applications that require connections on both sides.
42. Stack-up
The arrangement of different layers in a PCB, including the order of signal layers, ground layers, and power layers.
43. Crosstalk
An interference phenomenon that occurs between adjacent conductors, potentially affecting signal quality.
44. Package Design
The design of component packaging, including shape, size, and pin configuration.
45. Electrical Specification
Specific requirements regarding the electrical performance of the PCB, including parameters such as current, voltage, and frequency.
46. Thermal Conductivity
The ability of a material to conduct heat, affecting the heat dissipation efficiency of the PCB and temperature management of components.
47. Layer Conversion
The process of converting layer information in PCB design into a manufacturable format.
48. Electrostatic Discharge (ESD)
The impact of static electricity release on electronic components, requiring protective measures in PCB design.
49. Visual Inspection
The process of visually inspecting a PCB to ensure there are no visible defects or damage.
50. Test Point
A designated measurement point on a PCB used for electrical testing and troubleshooting.
51. Pin Pitch
The distance between component pins, which affects PCB design density and layout.
52. Current Density
The amount of current flowing per unit area, influencing heat generation and performance in the PCB.
53. Current Carrying Capacity
The maximum current a PCB can safely carry, determined by trace width and material characteristics.
54. Wave Soldering
A soldering process in which the PCB is immersed in molten solder, suitable for mass production.
55. Reflow Soldering
A soldering process that uses a heating and cooling cycle to melt and solidify solder, commonly used for surface-mounted components.
56. Gold Plating
The process of covering a layer of gold on a PCB to improve conductivity and corrosion resistance at connection points.
57. Tin Plating
A plating process that enhances solderability and corrosion resistance.
58. Substrate
The base material of the PCB, typically made of fiberglass or resin, which affects electrical performance and mechanical strength.
59. Tolerance
The allowable range of variation in dimensions during manufacturing, impacting circuit reliability.
60. Current Testing
The process of checking the flow of current through a PCB to ensure it meets design specifications.
61. Insulation Resistance
The resistance value of insulation materials, which affects the safety and reliability of the PCB.
62. Specification Sheet
A document listing the performance and design requirements of a PCB for reference during design and manufacturing.
63. RF PCB
A PCB specifically designed for high-frequency signal transmission, commonly used in communication and wireless devices.
64. Printing Technology
The techniques used to create patterns and markings on PCBs, including screen printing and inkjet printing.
65. Container
Packaging materials used for storing and transporting PCBs, which affect product safety and integrity.
66. Lifecycle
The entire process from design, production to disposal of a PCB, influencing product sustainability and environmental impact.
67. Optical Inspection
Using optical equipment to inspect a PCB for defects and non-conforming products.
68. Characteristic Impedance
The impedance characteristics of a transmission line that affect the integrity of signal transmission.
69. Load
The components or circuits connected to a PCB that influence the distribution of current and voltage.
70. Heat Dissipation
The ability to effectively dissipate heat through design and material selection to prevent overheating of components.
These terms encompass various aspects of PCB design, manufacturing, and testing. Mastering them is crucial for engineers and technicians in their practical work. A deeper understanding of these terms will enhance professional knowledge and facilitate effective communication and collaboration in complex projects.