Rogers 4360 is a high-performance PCB material designed specifically for microwave and RF applications. Known for its low dielectric loss, superior mechanical properties, and thermal stability, it is an ideal choice for modern high-frequency and high-speed circuit designs. The following is a detailed explanation of its characteristics from the perspectives of material properties, electrical performance, mechanical properties, application scenarios, and design considerations.
1. Material Properties
Stable Dielectric Constant (Dk)
The dielectric constant of Rogers 4360 is approximately 6.15, and it remains stable over a wide frequency range. This stability is crucial for high-frequency signal transmission, minimizing signal delay and distortion for reliable system performance.
Low Loss Tangent (Df)
The loss tangent (tanδ) of this material is 0.0038 (tested at 10GHz). This low loss greatly reduces signal attenuation, making it suitable for applications with strict signal integrity requirements, such as 5G communications and satellite systems.
Thermal Stability
Rogers 4360 exhibits excellent thermal stability and maintains consistent performance over a wide temperature range (-40°C to +150°C). This makes it well-suited for high-temperature environments.
Coefficient of Thermal Expansion (CTE)
Its Z-axis CTE is approximately 32 ppm/°C, which closely matches that of copper. This compatibility prevents delamination and thermal stress issues, especially in multilayer PCB applications.
Mechanical Strength and Reliability
The material has good mechanical strength and flexibility, is easy to process, and resists chemical corrosion, making it ideal for long-term use in harsh environments.
Compatibility
Rogers 4360 is highly compatible with traditional FR4 materials, allowing mixed stack-ups to reduce overall manufacturing costs while improving electrical performance.
2. Electrical Performance
High-Frequency Performance
Designed for high-frequency signal transmission, Rogers 4360 is an excellent choice for microwave, RF, and millimeter-wave applications. It ensures minimal signal attenuation and high signal integrity at frequencies above 10GHz.
Impedance Control
The stable dielectric constant and low loss tangent make Rogers 4360 ideal for circuits requiring precise impedance control (typically 50Ω or 75Ω). This ensures signal matching and quality.
Low Insertion Loss
Rogers 4360 significantly reduces signal insertion loss, improving transmission efficiency. This is especially important for long-distance transmission or high-power designs.
Low Dielectric Scattering
The material’s uniform internal structure reduces dielectric scattering, minimizing phase noise and spurious interference in high-frequency signals.
3. Mechanical Performance
Processing Capability
Rogers 4360 is easy to machine, supporting fine line processing and multilayer stacking.
Its smooth surface is ideal for surface treatments like ENIG.
Flatness
Due to its low CTE and excellent thermal stability, Rogers 4360 resists warping during lamination, ensuring flatness in multilayer PCBs.
Drilling and Metallization Reliability
The material’s stable structure provides high drill wall strength, and its strong bonding with copper ensures excellent performance during metallization.
4. Application Scenarios
Rogers 4360 is widely used in high-frequency, high-speed, and high-reliability circuit designs, including:
Telecommunications
5G base stations
Microwave wireless communication devices
High-speed internet routers and switches
Aerospace
Satellite communications
Navigation systems
Radar equipment
Automotive Electronics
Advanced Driver Assistance Systems (ADAS)
Vehicle radar
High-frequency control circuits for electric vehicles
Medical Devices
High-resolution imaging systems
RF treatment equipment
Test and Measurement
High-frequency signal testers
Microwave network analyzers
5. Design Considerations
Stack-Up Design
In high-frequency multilayer boards, Rogers 4360 can be paired with other high-frequency materials to create dedicated signal transmission and shielding layers.
Ensure the distance between power and ground planes meets impedance design requirements.
Trace Design
High-frequency traces should be as short and direct as possible, avoiding right-angle bends and using arcs or 45° angles instead.
Maintain sufficient spacing between critical signal lines to prevent crosstalk.
Thermal Management
For high-power circuits, use metal heat sinks or thermal materials to manage heat.
Consider thermal vias for uniform heat distribution in long-term high-temperature environments.
Manufacturing Process
Rogers 4360 requires specific lamination and drilling processes to prevent damage from excessive heat.
Use low-loss soldering materials to ensure reliable signal connections.
By adhering to these design principles, Rogers 4360 provides outstanding electrical performance and reliability for advanced applications.