1. Company Overview and Core Positioning
Shenzhen Xinchenger High-Frequency PCB Manufacturing Plant focuses on the research and production of high-frequency printed circuit boards (PCBs). It is committed to providing premium high-frequency circuit solutions for high-tech fields such as 5G communications, aerospace, automotive electronics, and medical devices. With advanced production equipment, stringent quality standards, and a professional technical team, the company has become a leader in the high-frequency PCB manufacturing industry.
2. Detailed Analysis of High-Frequency PCB Manufacturing Capabilities
Multilayer and High-Density Interconnect (HDI) Technology
Layer Support: Xinchenger can produce multilayer high-frequency PCBs with 2 to 64 layers to meet complex circuit demands.
HDI Technology: Provides laser microvia drilling and stacking processes, supporting 1-step to 3-step HDI structures, suitable for high-density routing.
Precision Assurance: Achieves a line width/spacing accuracy of 3/3 mil, meeting the needs of high-speed signal transmission and miniaturized designs.
High-Frequency Material Processing
Material Support: Processes top-tier materials such as Rogers, Taconic, Arlon, Isola, Nelco, and high-performance domestic high-frequency substrates.
Performance Optimization: Xinchenger has mature techniques for processing low-loss materials, ensuring stable signal integrity and dielectric properties.
Process Support: Precision cutting, drilling, and lamination techniques ensure the integrity of material properties during manufacturing.
Microvia and Laser Drilling Technology
Laser Drilling: Supports microvia diameters as small as 0.1mm, fulfilling the demands of blind, buried, and through-hole applications in high-density designs.
Mechanical Drilling: Utilizes high-speed drilling equipment for thick copper and high Tg materials, ensuring smooth via walls and consistent quality.
Via Wall Metallization: Uses continuous electroplating and chemical plating processes to achieve uniform and reliable via wall metallization.
Impedance Control and High-Density Routing
Impedance Matching: Provides stringent impedance control with a tolerance of ±5%, meeting the requirements of RF communication and high-speed signals.
Routing Process: Supports fine-pitch routing for complex circuit designs, addressing challenges of high-speed signal transmission.
Lamination and Stacking Technology
Multi-Lamination Cycles: Equipped with high-precision lamination equipment to support multi-lamination processes, ensuring accurate layer alignment and board flatness.
Thermal Expansion Control: Implements stepwise lamination techniques to minimize material stress caused by differing coefficients of thermal expansion.
3. Surface Treatment and Testing Technologies
Surface Treatment Processes
Offers diverse surface treatments, including ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), immersion silver, immersion tin, and organic coatings.
Precisely controls coating thickness to meet soldering reliability and oxidation resistance requirements for high-frequency PCBs.
Utilizes plasma cleaning equipment to ensure the surface cleanliness of high-frequency circuits, avoiding soldering defects.
Testing and Inspection Capabilities
Automated Optical Inspection (AOI): Uses high-resolution cameras and intelligent algorithms to inspect each layer of circuitry, detecting defects such as open circuits and short circuits.
X-Ray Inspection: Inspects the internal structure of multilayer boards to ensure the quality consistency of blind and buried vias.
Flying Probe Testing: Conducts comprehensive conductivity and impedance tests on high-frequency PCBs, achieving 100% coverage.
Reliability Testing
Conducts peel strength tests on microvias to verify the quality of via wall metallization.
Performs high-frequency signal transmission tests to ensure that signal loss and reflection meet customer requirements.
4. Smart Production and Customization Services
Smart Manufacturing Capabilities
Automated Equipment: Equipped with laser drilling machines, automated plating lines, and intelligent storage systems to achieve fully automated production.
ERP/MES Integration: Fully integrates production and management systems, enabling real-time tracking of orders, process optimization, and quality control.
Customization Services
Provides tailored services from prototype development to mass production, catering to diverse scales and complexity requirements.
Offers material selection and design optimization suggestions to meet specific high-frequency circuit board requirements.
5. Application Fields and Success Stories
Major Application Fields
Telecommunications Industry: Core circuit boards for high-frequency antennas and 5G base stations.
Automotive Electronics: High-frequency PCBs for autonomous driving millimeter-wave radars and vehicle communication modules.
Medical Devices: Core circuits for high-frequency imaging devices and RF treatment instruments.
Aerospace: High-frequency circuits for navigation and communication systems.
Success Stories
Provided high-frequency PCBs for leading domestic 5G equipment manufacturers, significantly enhancing product performance and market competitiveness.
Supported overseas automotive electronics companies in developing millimeter-wave radar circuit boards, reducing production cycles by 30%.
6. Core Advantages
Technological Leadership
Specializes in the high-frequency field for years, possessing comprehensive technical expertise from material processing to final assembly.
Introduces advanced testing and manufacturing equipment to ensure products meet the highest industry standards.
Quality Assurance
Certified under ISO9001, ISO14001, and IATF16949, establishing a rigorous quality control system.
Performs 100% inspection at every process stage to ensure customers receive high-quality products.
Service Excellence
Offers efficient project management and technical support teams to provide professional services to customers.
Quickly responds to market demands, offering flexible delivery timelines.
7. Future Outlook Shenzhen Xinchenger High-Frequency PCB Manufacturing Plant will continue to deepen its technical research in the high-frequency PCB field, expanding applications in emerging markets such as 5G communications, intelligent driving, and aerospace. Through intelligent and digital transformation, the company will further enhance efficiency, optimize quality, and deliver greater value to its customers.
This detailed explanation outlines the professional capabilities of Shenzhen Xinchenger, showcasing its technological strengths, market applications, and future potential in the high-frequency PCB manufacturing sector.