RO4350B Electrosoft Gold PCB

RO4350B Electrosoft Gold PCB

Surface Process: Electro-soft Gold 8U
Lamination: 4350B(10mil+30mil+0.254+4450F*2)
Shipment Size: 76.2*53.9mm (Collocation 1 out of 2)
Board Thickness: 1.6mm
Green Oil with White Characters
Copper Thickness: Inside 0.5oz Outside 1oz

Description

1. Material Introduction
RO4350B, developed by Rogers Corporation, is a high-frequency laminate designed for RF and microwave applications. It is a low-moisture, glass-reinforced composite material offering stable performance, excellent electrical properties, mechanical reliability, and reduced manufacturing costs.
The main characteristics of RO4350B include:
Dielectric Constant (Dk): 3.48 ± 0.05 (at 10 GHz).
Dissipation Factor (Df): 0.0037 (at 10 GHz).
Low Thermal Expansion Coefficient, matching well with copper for improved stability in high-temperature conditions.
Low Moisture Absorption: Less than 0.1%, ensuring consistent electrical performance in humid environments.
Thickness Range: 0.1 mm to 3.2 mm to accommodate various design requirements.
Copper Foil Thickness: Standard options from 0.5 oz to 2 oz, compatible with electrolytic gold plating.
2. Overview of Electrolytic Gold Plating
Electrolytic gold plating is a widely used surface treatment in PCB manufacturing. It involves depositing a gold layer to enhance conductivity, oxidation resistance, and solderability.
The process of electrolytic gold plating includes:
Cleaning: Removal of oxides and impurities from the copper surface.
Nickel Plating: Deposition of a 3-8 µm nickel layer as an intermediate layer.
Gold Plating: Electroplating a 0.5-3 µm layer of 99.99% pure gold for enhanced softness and durability.
Key benefits of electrolytic gold plating include:
Oxidation Resistance: The gold layer offers excellent anti-oxidation properties for long-term reliability.
High Conductivity: The pure gold layer ensures superior electrical transmission.
Solderability: Electrolytic gold provides outstanding soldering and wear resistance properties.
3. Advantages of RO4350B Electrolytic Gold PCB
High-Frequency Performance: Low loss and stable dielectric constant make it ideal for high-frequency RF applications.
Electrolytic Gold Finish: Ensures superior oxidation resistance and contact performance.
Mechanical Stability: Maintains dimensional stability in high-temperature and humid conditions.
Cost-Effective Process: RO4350B is compatible with FR-4 manufacturing techniques, reducing overall production costs.
4. Applications
RO4350B Electrolytic Gold PCBs are widely used in:
Telecommunication Equipment: Base station antennas, RF power amplifiers, and filters.
Automotive Electronics: Vehicle radar systems and ADAS (Advanced Driver Assistance Systems).
Aerospace and Defense: Satellite communication and navigation systems.
High-End Test Equipment: Microwave test instruments and network analyzers.
RO4350B Electrolytic Gold PCBs combine superior high-frequency performance, reliable electrolytic gold treatment, and mechanical stability, making them a leading choice in RF and microwave industries. As electronic technologies continue to evolve, RO4350B’s low-cost and high-performance properties will play a significant role in future applications.

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