RO4350B High Frequency PCB

Description

RO4350B is a high-frequency PCB material manufactured by Rogers that offers a range of excellent properties that make it ideal for high-frequency applications. Below is a detailed description of the properties, application areas and processing requirements for RO4350B 4-layer HF PCBs:

RO4350B 4-Layer High Frequency PCB Characteristics:
Dielectric Constant (Dk): 3.48 +/- 0.05, which means it can provide stable electrical performance over a wide frequency range.
Loss Factor (Df): 0.0037 @ 10GHz, the low loss characteristics help minimize losses in signal transmission.
Z-axis Coefficient of Thermal Expansion (CTE): 32 ppm/°C. The low CTE contributes to the product’s dimensional stability.
Flame Retardant: UL 94 V-0 rated for active devices and high power RF designs.
Processing: Similar to standard epoxy/glass (FR-4), easy to produce in high volume without special through-hole treatments or handling procedures.
Cost-effective: RO4350B offers a more cost-effective solution compared to PTFE materials.

RO4350B 4-layer HF PCB Application Areas:
Radio Backhaul: For radio signal transmission and reception.
Communication Systems: Including cellular network base stations, satellite communications, etc.
High-speed Computing: RF circuits used in high-performance computing devices.
IP Infrastructure: Used for RF modules in network equipment.
Power Amplifiers: Used for signal amplification in wireless communications.
Small Base Station/Distributed Antenna System (DAS): Used in small base stations to provide wireless coverage.
Test and Measurement: Used in RF test and measurement equipment.
Automotive Radar and Sensors: For radar sensors in automotive safety systems.
Radio Frequency Identification (RFID) Tags: For wireless identification and tracking tags.

RO4350B 4-layer HF PCB Processing Requirements:
Drilling: Precise control of the drilling process is required to avoid damage to the board.
Lamination Process: Precise control of temperature, pressure and time is required to ensure good adhesion between layers.
Surface Treatment: Common surface treatments include gold immersion, gold plating, etc. to improve soldering performance and oxidation resistance.
Impedance Control: The impedance of the line needs to be precisely controlled to ensure stable signal transmission.
Layer Structure: Reasonable layer structure helps to control impedance and reduce signal crosstalk.
Layout and Wiring: Layout and wiring should minimize signal path length and crossover to reduce signal distortion and crosstalk.
Ground Plane Design: Good ground plane design helps to absorb signal return and reduce signal reflection and interference.
Environmental Control: Processing is carried out in a constant temperature and humidity environment to minimize the impact of environmental factors on board performance.
Quality Testing: Strict quality testing is required, including impedance testing and thermal performance testing.
These characteristics of RO4350B make it an ideal material for high-frequency PCB design and manufacturing, especially in applications requiring high performance and reliability.