F4BM255 PCB

Description

1. Parameters of F4BM255 PCB
F4BM255 is a high-performance microwave laminate specifically designed for high-frequency circuits. It features excellent electrical and thermal stability. Key parameters include:
Dielectric Constant (Dk): 2.55 ± 0.02 (@10GHz)
Provides stable dielectric properties for accurate and reliable signal transmission.
Dissipation Factor (Df): 0.0010 (@10GHz)
Ultra-low loss suitable for high-frequency and high-speed signal transmission.
Coefficient of Thermal Expansion (CTE):
X, Y Direction: 17 ppm/°C
Z Direction: 25 ppm/°C
Outstanding thermal expansion performance with excellent copper foil compatibility, reducing delamination risks.
Thermal Conductivity:
0.30 W/(m·K), ensuring efficient heat dissipation, ideal for high-power devices.
Water Absorption:
≤ 0.02%, ensuring stable performance in humid environments.
Glass Transition Temperature (Tg):
280°C, making it suitable for high-temperature manufacturing and operation.
Peel Strength: 1.2 N/mm, delivering superior reliability in multilayer PCB applications.
2. Application Fields
F4BM255 PCB is widely used in the following fields due to its excellent performance:
Wireless Communications:
Suitable for antennas, power amplifiers, and microwave filters, particularly in 5G base stations and satellite communications.
Radar Systems:
Applied in military and civilian radar systems for precise and stable high-frequency signal processing.
Aerospace:
Ideal for avionics, drone control systems, and missile guidance systems in demanding environments.
High-Power Electronics:
Used in RF modules and power modules, ensuring efficient heat dissipation and stable operation.
Medical Devices:
Applied in high-frequency imaging systems such as MRI and CT scanners.
Automotive Electronics:
Used in advanced driver assistance systems (ADAS) and automotive radar systems.
3. Production Description
Material Characteristics:
F4BM255 uses polytetrafluoroethylene (PTFE) as the base material, reinforced with glass fiber cloth, and high ceramic filler content. This combination offers low-loss performance with enhanced mechanical strength.
Lamination Process:
The manufacturing process requires precise control of temperature, pressure, and timing to ensure uniformity and consistent performance.
Processing Guidelines:
Drilling:
Use diamond-coated or specialized drill bits to prevent microcracks and material damage.
Cleaning:
Plasma treatment is recommended to remove residues and enhance copper foil adhesion.
Etching:
Precise control of the etching process prevents damage to the dielectric layer.
Quality Standards:
Every batch of PCBs undergoes the following tests:
Electrical Performance Tests: Including dielectric constant (Dk) and dissipation factor (Df).
Mechanical Strength Tests: Ensuring peel strength and lamination quality.
Thermal Reliability Tests: Verifying stability under extreme temperatures.
Environmental Compliance:
Compliant with international environmental standards such as RoHS and REACH, enabling global applications.