Description
Double-sided F4B immersion gold PCB is a high-performance printed circuit board that combines the excellent electrical characteristics of F4B material with the anti-corrosion and oxidation resistance of immersion gold process. This type of PCB excels in high-frequency signal transmission, high-speed data processing, and applications in harsh environments, and is widely used in fields such as communication, aerospace, and medical equipment.
1. Characteristics of F4B Material
Electrical Performance: F4B material is known for its low dielectric constant (Dk value less than 2.65) and low dissipation factor (Df value less than 0.001), which help reduce signal attenuation and delay, improving signal integrity.
Thermal Stability: F4B material can maintain stability across a wide temperature range, from -200℃ to 200℃, making it suitable for extreme temperature environments.
Mechanical Performance: F4B material has high wear resistance and excellent rigidity and strength, ensuring stability and durability under mechanical stress.
2. Advantages of Immersion Gold Process
Anti-Oxidation: The immersion gold process protects the copper layer by depositing a layer of nickel and a layer of gold to prevent oxidation and corrosion, extending the service life of the PCB.
Good Soldering: The gold layer provides a good soldering surface, ensuring the reliability of soldering and the stability of the circuit.
Excellent Electrical Performance: Immersion gold surface treatment offers low contact resistance and excellent conductivity, suitable for high-frequency and high-speed applications.
3. Manufacturing Process of Double-Sided F4B Immersion Gold PCB
Material Preparation: Select uniform high-quality F4B sheet materials to ensure material consistency.
Drilling: Use laser or mechanical drilling technology to ensure precise hole positioning and smooth hole walls.
Lamination: Through high-temperature and high-pressure lamination processes, ensure tight bonding between layers.
Pattern Transfer: Use exposure machines or LDI technology to precisely transfer circuit patterns onto the sheet.
Etching: Use chemical or laser etching technology to remove excess copper layers to form the required circuit patterns.
Surface Treatment: Perform immersion gold treatment, including the deposition of chemical nickel and chemical gold.
4. Application Fields of Double-Sided F4B Immersion Gold PCB
Wireless Communication: In mobile phones, base stations, satellite communication equipment, F4B immersion gold PCB ensures the stability of high-frequency signal transmission.
Radar Systems: Radar systems in military and aviation fields have extremely high performance requirements for circuit boards, and F4B immersion gold PCB has become the preferred material due to its low loss and stable electrical characteristics.
Aerospace: In the navigation and communication systems of spacecraft, the high-temperature resistance and electrical stability of F4B immersion gold PCB play a crucial role.
Medical Equipment: In high-end medical equipment such as MRI, F4B immersion gold PCB provides reliable technical support for medical diagnostics.
5. Environmental Protection and Economic Benefits
F4B immersion gold PCB reduces the production of harmful substances during the manufacturing process, and the material is recyclable, playing a positive role in environmental protection. Additionally, due to its long service life, it reduces resource consumption, meeting the requirements of sustainable development.
Double-sided F4B immersion gold PCB, with its excellent electrical performance, mechanical performance, and environmental adaptability, has become the ideal choice for high-performance electronic devices. It not only meets the needs of high-performance applications but also provides environmentally friendly and economical solutions.
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