1. Basic Parameters of Rogers 4350B PCB
Rogers 4350B (RO4350B) is a laminate material widely used in high-frequency circuit designs. It offers high performance, low cost, and compatibility with standard FR4 processes, making it an ideal choice for RF and microwave applications. Below are its key parameters:
Dielectric Constant (Dk):Typical value at 10 GHz is 3.48 (±0.05).
Stable Dk enables precise impedance control in RF circuits.
Dissipation Factor (Df):
Typical value at 10 GHz is 0.0037.
Low Df minimizes signal loss during high-frequency transmission.
Thermal Expansion Coefficient (CTE):
X and Y directions: 11 ppm/°C, closely matching copper for thermal stability.
Z direction: 32 ppm/°C, improving reliability.
Thermal Conductivity:
Typical value is 0.62 W/m·K, providing moderate thermal management support.
Water Absorption Rate:
Extremely low at 0.06%, ensuring excellent dimensional stability and electrical performance in humid environments.
Processing Characteristics:
Supports mechanical drilling and laser cutting, easy to process, and compatible with FR4 manufacturing techniques.
Wide range of copper foil thicknesses (0.5oz to 2oz) for diverse design needs.
Flammability Rating:Compliant with UL 94 V-0 standards, ensuring high safety.
2. Application Fields
Thanks to its outstanding performance, Rogers 4350B is widely used in various electronic devices requiring high frequency and high reliability. Specific application fields include:
Wireless Communication Devices:
Used in base station antennas, RFID systems, and WLAN equipment.
Stable dielectric constant and low loss factor make it ideal for high-frequency transmission.
Automotive Electronics:
Applied in automotive radars (e.g., ADAS systems) and high-frequency circuit modules.
High thermal stability and durability meet demanding automotive requirements.
RF and Microwave Circuits:
Includes power amplifiers, filters, power dividers, and more.
Precise impedance control supports complex RF system designs.
5G Communication Technology:
Supports the design and manufacturing of 5G base stations and millimeter-wave antennas.
Low loss characteristics enhance signal quality and transmission efficiency.
High-Performance Computing and Data Centers:
Used in high-speed backplanes, high-speed interconnects, and other high-frequency digital applications.
Maintains stable electrical performance for high-speed data transmission.
Defense and Aerospace:
Deployed in radar systems, satellite communications, and electronic warfare equipment.
Delivers stable and reliable performance in extreme environments.
3. Production Guidelines
While Rogers 4350B is relatively easy to process, attention to specific production steps is necessary to maximize its performance.
Design Phase:
Impedance Control:
Due to its stable Dk and low loss, impedance matching design is crucial in high-frequency applications.
Use professional electromagnetic simulation tools (e.g., HFSS or ADS) for accurate modeling.
Stack-Up Design:
Can be combined with FR4 substrates (hybrid laminates) to balance cost and performance.
Address differences in thermal expansion coefficients to avoid warping or delamination.
Material Cutting:
Use laser cutting or precision mechanical cutting tools to ensure smooth edges and avoid damage due to material flexibility.
Deburr immediately after cutting to maintain dimensional accuracy.
Drilling and Plated Through-Holes:
Reduce drill speed during drilling to minimize heat impact on the material.
Ensure smooth hole walls for optimal conductivity and mechanical strength during plating.
Lamination and Bonding:
Use low-temperature lamination processes, recommended below 288°C, to prevent delamination or performance degradation.
Apply uniform heating and appropriate pressure during lamination to ensure strong layer bonding.
Surface Treatment:
Common surface treatments include ENIG, immersion tin, and OSP.
Avoid using high-temperature chemical solutions during processing to prevent material deformation.
Testing and Quality Control:
Test finished PCBs using a high-frequency network analyzer to evaluate dielectric constant, loss factor, and impedance consistency.
Conduct thermal cycling tests to verify the product’s high-temperature resistance and mechanical stability.
4. Usage and Storage Precautions:
Store materials in a dry, sealed package, avoiding high humidity and high-temperature environments.
Avoid excessive bending or stretching during processing to prevent damage to the substrate structure.
For high-precision applications, manufacturing and assembly are recommended in a dust-free environment.