The different structural layers of a PCB (Printed Circuit Board) have a significant impact on the performance of the board. The following are some common PCB structural layers and their performance description:

Single-Layer PCB (Single-Layer PCB):

Structure: Only one conductive layer, usually used for simple circuits.
Performance: Lower cost, suitable for low-complexity applications, such as electronic toys, LED light control boards.
Double-Layer PCB (Double-Layer PCB):

Structure: Contains two conductive layers, connected by connection holes (vias), usually one layer is used for routing and component mounting, and the other layer is used as a power or ground plane.
Performance: Suitable for more complex circuits such as consumer electronics, medical devices and industrial control systems.
Four-Layer PCB:

Structure: Typically contains two signal layers and two power/ground layers to provide better signal integrity and power management.
Performance: Suitable for applications requiring high signal integrity and power stability, such as high-speed digital circuits.
Six-Layer PCB (Six-Layer PCB):

Structure: Typically contains four signal layers and two power/ground layers, which can be further optimized for electromagnetic interference and signal transmission speed.
Performance: Suitable for high-frequency circuits and high-density wiring, such as high-performance servers and communications equipment.
Eight-Layer PCB (Eight-Layer PCB):

Structure: Four signal layers and four power/ground layers provide better signal integrity and power distribution.
Performance: Suitable for high-speed, high-density circuit design, such as high-end networking equipment and high-performance computing systems.
Ten-Layer and Above PCB (Ten-Layer PCB):

Structure: More signal layers and power/ground layers for greater design flexibility and better electrical performance.
Performance: Suitable for very high-speed, high-density, complex electronic systems such as high-performance servers, high-speed communication equipment and military electronic systems.
Advantages of Mmulti-layer PCBs Include:

Smaller size and weight for portable devices.
Higher assembly density for longer board life.
Simpler construction, eliminating the need for multiple connectors with separate PCBs.
Faster electrical characteristics and better immunity to interference.

High TG (Glass Transition Temperature) Materials:

Properties: High TG materials provide improved heat resistance and mechanical strength for high temperature environments and applications requiring high reliability.
Impedance Control:

Impedance control is an important consideration in multilayer PCB design, especially in high-speed digital circuits and radio frequency (RF) applications. By accurately controlling the width of the alignment and the distance from the reference layer, specific impedances such as 50 ohms or 75 ohms can be designed to ensure signal integrity.
Blind/Buried Vias Technology:

Blind Vias: Connect the outer layer to at least one inner layer without penetrating the entire board.
Buried Vias: Connects two or more inner layers without extending into the outer layer.
Performance: These techniques increase wiring density and reduce the number of PCB layers, thereby reducing cost and improving reliability.
Rigid-Flex PCB (Rigid-Flex PCB):

CONSTRUCTION: Combines the features of rigid PCBs and flexible circuits for use in applications that require bending or folding.
Performance: Provides design flexibility and is suitable for wearable devices, folding cell phones, and more.
HDI (High-Density Interconnect) Technology:

High-Density Interconnect technology allows more circuits to be laid out in less space by using thinner alignments and smaller holes.
Performance: Suitable for high-density electronic devices such as smartphones and tablets.
Thermal Management:

Thermal management is a key factor in high-performance electronic devices. Multi-layer PCBs can help dissipate heat by designing heat transfer paths and using highly thermally conductive materials.
Electromagnetic Compatibility (EMC) and Signal Integrity (SI):

EMC and signal integrity need to be considered in multilayer PCB design. EMI can be reduced and signal quality improved through proper layer design, shielding and grounding strategies.
Cost and Manufacturing Complexity:

As the number of layers increases, so does the cost and complexity of PCB manufacturing. Therefore, performance requirements need to be balanced with cost effectiveness during design.
When selecting the number of PCB layers, factors such as the number of signal networks, device density, PIN density, and signal frequency need to be considered. For designs with a large number of signal networks, high device and PIN densities, and high signal frequencies, a multilayer board design should be used to obtain better EMI performance and signal integrity. At the same time, the manufacturing process of multilayer PCBs requires higher precision and strict quality control to ensure the reliability and performance of the final product.