1. Parameters of F4BM220 PCB
F4BM220 is a high-performance microwave composite substrate commonly used in high-frequency and RF circuits. Key parameters are as follows:
Dielectric Constant (Dk): 2.2 ± 0.02 (@10GHz)
Stable dielectric constant for high-precision, high-frequency applications.
Dissipation Factor (Df): 0.0009 (@10GHz)
Ultra-low loss for improved signal transmission quality.
Coefficient of Thermal Expansion (CTE):
X, Y Direction: 16 ppm/°C
Z Direction: 24 ppm/°C
Excellent thermal stability with a good match to copper foil, reducing delamination during thermal cycling.
Thermal Conductivity:
0.25 W/(m·K), providing good heat dissipation, ideal for high-power devices.
Water Absorption:
≤ 0.02%, ensuring stability in high-humidity environments.
Operating Temperature:
Up to 260°C, suitable for demanding environments.
2. Application Fields
F4BM220 PCB is widely used in the following fields due to its excellent high-frequency performance and reliability:
RF and Microwave Circuits:
Applications include antennas, filters, and power amplifiers, especially in satellite communications and radar systems.
5G Communications:
Used in high-frequency, high-speed 5G base station equipment, ensuring low-loss and highly stable signal transmission.
Aerospace:
Suitable for avionics, missile systems, and drones, meeting the demand for highly reliable materials.
Medical Devices:
High-precision imaging systems and diagnostic equipment, such as MRI and CT systems.
High-Power Electronics:
Applied in high-power RF components and power modules requiring excellent heat dissipation.
3. Production Description
Material Characteristics:
F4BM220 uses polytetrafluoroethylene (PTFE) as the base material and reinforces it with glass fiber cloth, maintaining the low-loss property of PTFE while enhancing mechanical strength.
Lamination Process:
The manufacturing process requires precise control of temperature and pressure to ensure uniformity and consistent performance.
Processing Guidelines:
Drilling: Use diamond-coated drill bits to minimize mechanical damage to the material.
Surface Treatment: Proper chemical treatment or plasma cleaning is required to ensure good adhesion between the copper foil and the substrate.
Etching: Precise control of the etching process is necessary to avoid damage to the dielectric layer.
Quality Standards:
Each batch undergoes electrical performance tests (Dk and Df), thermal reliability tests, and mechanical strength tests.
Environmental Compliance:
F4BM220 complies with RoHS and REACH environmental standards, enabling its use globally.