1. Key Specifications of F4B TP-2 PCB
F4B TP-2 is a PTFE-based copper-clad laminate widely used in high-frequency circuit applications. It combines excellent electrical performance, mechanical strength, and thermal stability, making it ideal for transmitting high-frequency signals. The key specifications are as follows:
Dielectric Constant (Dk):
The dielectric constant is 2.20±0.02, ensuring highly stable electrical performance under high-frequency conditions.
Dissipation Factor (Df):
A low dissipation factor of 0.001 (@10GHz) minimizes signal loss, suitable for precision high-frequency designs.
Coefficient of Thermal Expansion (CTE):
CTE values are 17 ppm/°C in the X/Y axes and 24 ppm/°C in the Z-axis, providing excellent thermal compatibility with copper for multilayer PCB manufacturing.
Thermal Conductivity:
Thermal conductivity is 0.25 W/m·K, suitable for applications with moderate heat dissipation requirements.
Water Absorption:
Extremely low water absorption (<0.02%) ensures stable electrical performance in humid environments.
Flammability Rating:
Compliant with UL 94 V-0 flame-retardant standards, ensuring high safety.
Thickness Range:
Available in various thicknesses, such as 0.5mm, 0.8mm, 1.0mm, and 1.5mm, to meet different design requirements.
Mechanical Properties:
High tensile strength and dimensional stability for demanding application environments.
2. Applications
F4B TP-2 PCB materials are widely used in high-frequency fields and applications requiring high reliability. Major application areas include:
Wireless Communication Equipment:
Suitable for base station antennas, RF modules, filters, and power amplifiers.
Radar Systems:
Extensively used in automotive radar and military radar systems, meeting precise signal transmission needs.
Satellite Communication:
Applied in satellite antennas and signal processing modules, maintaining stable performance in extreme environments.
Automotive Electronics:
Used in ADAS (Advanced Driver Assistance Systems) and automotive millimeter-wave radar systems.
Medical Devices:
Suitable for high-frequency imaging devices such as MRI and CT systems.
Test and Measurement Equipment:
Utilized in high-frequency testing instruments and signal analysis equipment, ensuring high-precision measurements.
Microwave Circuits and Sensors:
Widely used in microwave circuit boards, microstrip antennas, and high-frequency sensors.
3. Manufacturing Guidelines
Material Inspection and Preparation:
Inspect F4B TP-2 materials for defects such as scratches, bubbles, or contamination before use.
Clean the material to remove grease and dust prior to processing.
Lamination Process:
Maintain controlled pressure and temperature during the lamination process to prevent material deformation.
Recommended lamination temperatures range from 350℉ (176℃) to 450℉ (232℃) with uniform pressure.
Drilling Process:
Use high-quality carbide drill bits with controlled drilling speeds and feed rates to minimize burrs and hole wall damage.
After drilling, activate the hole walls using plasma treatment to enhance metal adhesion.
Hole Wall Metallization:
Perform chemical copper plating and electroplating on treated hole walls to ensure electrical conductivity and mechanical strength.
Pattern Transfer and Etching:
Use high-precision photolithography to transfer circuit patterns onto the copper-clad laminate, followed by accurate etching processes.
Avoid over-etching to preserve the integrity of the copper layer needed for signal transmission.
Surface Treatment:
Depending on customer requirements, perform surface treatments such as solder leveling or gold plating to ensure solderability and corrosion resistance.
Testing and Quality Validation:
Conduct electrical performance tests on finished PCBs, including dielectric constant, dissipation factor, and other critical parameters.
Perform thermal cycling and mechanical strength tests as needed to ensure product reliability in applications.
Quality Management and Certification:
Follow ISO 9001 quality management standards throughout production.
Ensure compliance with industry-specific certifications, such as aerospace, military, or automotive standards.
Packaging and Transportation:
Use anti-static, moisture-proof packaging for finished F4B TP-2 PCBs.
Implement shock-proof measures during transportation and avoid heavy pressure or mechanical impacts to prevent product damage.