PCB copper thickness, that is, the thickness of copper foil in the printed circuit board (PCB), is one of the key factors affecting the performance of the circuit board. It is directly related to the circuit board’s electrical conductivity, heat dissipation ability, mechanical strength and overall reliability. The following is a detailed description of the performance requirements and role of PCB copper thickness:

Performance Requirements:
Conductive Performance: Copper thickness directly affects the resistance and conductivity of the circuit board. A thicker copper layer reduces resistance and increases conductivity, thereby reducing power loss and signal delay.
Heat Dissipation Properties: Copper is a good thermal conductor, thick copper layer can improve the thermal conduction efficiency of the circuit board, which helps to disseminate the heat generated by the electronic components to reduce the operating temperature.
Mechanical Strength: A thick copper layer can increase the rigidity and durability of the PCB, making it more resistant to mechanical stress and physical impact, reducing the risk of damage during transportation and use.
Current Carrying Capacity: Thick copper layers can carry higher currents for high power applications such as power supplies, motor controls and electric vehicle chargers.
Thermal Management: In high power density applications, thick copper PCBs require effective thermal management designs such as proper heat sinks and heat channels.
Manufacturing Process: The manufacturing process for thick copper PCBs is relatively complex, including steps such as plating, etching, and press-fit, which require precise control to ensure the uniformity and quality of the copper layer.
Role:
Improve Electrical Performance: Thick copper layers can reduce the resistance and inductance of circuits, improve signal integrity, reduce noise and interference, and are suitable for high-speed digital circuits and high-frequency communication equipment.
Enhanced Heat Dissipation: Thick copper layers act as an effective heat dissipation path, helping to prevent electronic components from overheating and improving system stability and longevity.
Enhanced Mechanical Strength: Thick copper layers provide better mechanical support, especially for large device-free areas, plug and socket fixing holes, edge connectors and other locations.
Improved Reliability and Stability: Proper copper thickness provides sufficient mechanical strength to prevent boards from bending, breaking, or cracking during use, and improves solder quality.
Supports High Power Applications: In high power applications, thick copper PCBs can safely and stably transmit high currents and reduce thermal stress on the circuit.
Simplifies Design and Manufacturing Processes: In some complex designs, by appropriately increasing copper thickness, the number or width of required alignment layers can be reduced, simplifying wiring design and reducing the difficulty and cost of multilayer board fabrication.
Environmental Adaptability: Thick copper PCBs are better able to resist corrosion and oxidation when facing harsh environments such as high temperatures and high humidity, extending the life of the board.
Cost Effectiveness:

While thick copper PCBs are more expensive to manufacture, their benefits in high-reliability and high-performance applications often offset this cost.
PCB copper thickness is an important factor in ensuring board performance and reliability. During the design and manufacturing process, the appropriate copper thickness needs to be selected based on application requirements and cost considerations to achieve optimum circuit performance and product reliability.