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RO3010 Wireless High Frequency PCB
Line Width : 4MIL ;
Line Spacing : 5MIL ;
Drilling Diameter : = 0.2mm ;
Processing Size : 500 * 1000mm
Plate Thickness : 2mm ;
Processing Layers : 10 layers;
Special Process : Thick gold plate, mechanical blind hole, etc.
Surface Treatment Processes : Include OSP, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.
Rogers RO3010 HF Board Material Parameters:
Rogers RO3010 series HF circuit materials are PTFE composites with added ceramic fillers, the application of this material makes the RO3010 series & strong & gt; sdielectric constant extremely temperature stable. When working at 10GHz and the temperature changes from -50℃ to +150℃, the thermal stability coefficient (Z direction) of its dielectric constant can reach -3ppm/℃. Much less will the PTFE glass material at room temperature dielectric constant step change.
At the same time, RO3010 also maintains a high dielectric constant frequency stability and can be used over a wide frequency range.RO3010 laminates also exhibit a very low dielectric loss of 0.0013 at 10 GHz.
