Taconic TSM-DS3 High Frequency PCB

Line Width : 4MIL ;

Line Spacing : 3.5MIL ;

Drilling Diameter : =1mm ;

Processing Size : 600 * 1000mm;

Plate Thickness : 3mm ;

Processing Layers : 4 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

INQUIRY

Taconic TSM-DS3 is a thermally stable, industry-leading low loss (Df = 0.0011 at 10 GHZ) epoxy resin that can be manufactured with the best predictability and consistency of glass fiber reinforced epoxy resins. Taconic TSM-DS3 is a ceramic-filled reinforcement with a very low glass fiber content (~5%) comparable to that used in the manufacture of large, complex multilayer membranes.

Taconic TSM-DS3 was developed for high power applications (thermal conductivity = 0.65 W/M * K) where the dielectric material must conduct heat away from other heat sources in the PWB design. Taconic TSM-DS3 was also developed with an extremely low coefficient of thermal expansion to meet demanding thermal cycling requirements.

The Taconic TSM-DS3 core, combined with Taconic fast Rise™ 27 (Df = 0.0014,10 GHz) prepreg, is an industry-leading solution for achieving the lowest dielectric loss at epoxy-like manufacturing temperatures of 420˚F. The low insertion loss of Taconic TSM-DS3 / fast Rise™ 27 can only be achieved achieved by fusion bonding (melting pure Teflon® laminates from 550˚F to 650˚F). Fusion bonding is expensive, causes excessive material movement and puts pressure on plated through holes. For complex multilayers, the low throughput pushes up the final material cost. Fast Rise™ 27 enables sequential lamination of TSM-DS3 at temperatures as low as 420˚F with consistency and predictability, reducing costs.

For microwave applications, low x, y, and z CTE values ensure very low temperature shift in the critical spacing between traces in filters and couplers. Taconic TSM-DS3 can be used with very thin copper foils to produce smooth copper edges between coupling lines.

Taconic TSM-DS3 <a class='inkey' href='https://www.szxcepcb.com/Aviation-pcb/taconic-rf-35-aviation-high-frequency-pcb' target='_blank'>High Frequency PCB</a>

Alignment on multiple layers is critical for yield and copper weight variations, and copper etching on panels can lead to nonlinear movement. Non-linear movement on large panels results in drilled holes that do not align with the pad and possible open circuits.

A. The Taconic TSM-DS3 is compatible with Ticer® and Ohmega Ply® resistor foils.

B. The Taconic TSM-DS3 has a dielectric constant deviation of +/- 0.2% from temperature.

C. Loss factor varies between 0.0007 - 0.0011 over the typical application temperature range.

D. Insertion loss comparison between TSM-DS3 and synthetic rubber hydrocarbon laminates. Using Southwest connectors shows the test experiments shown below.

E. Benefits and Applications: