Taconic PCB Factory

Taconic HF Plates Commonly Used Plate Models are As Follows：

tlx-0, tlx-9, tlx-8, tlx-7, tlx-6, tlx-5a, tlx-5, tlx-3, ht1.5, tlc-27, tle-95, tlc-30, tpg-30, tlg-30, rf-30, tsm-30, tlc-32, tpg32, tlg-32, tlg-34, tpg35, tlg-35, rf-35, rf-35a, rf-35p, rf-41, rf-43, rf-45, rf-60a, cer-10…

Taconic HF Plate Common Plate Specification Size： mm*mm

304*457, 406*457, 457*610, 406*914, 610*914, 457*1220, 914*1220

12*18、16*18、18*24、16*36、24*36、18*48、36*48…

The above is our commonly used Taconic commonly used boards and commonly used specifications and dimensions, Shenzhen Xin Cheng Er Electronic Technology Co., Ltd. mainly do Rogers / Rogers high-frequency board / F4BME high-frequency antenna board / high-frequency circuit boards / high-frequency circuit boards / high-frequency circuit boards / microwave radio frequency boards, etc., which also includes Rogers high-frequency boards, Wangling F4BM high-frequency circuit boards, the Sino-British and Fusidic series of HF circuit boards with dielectric constants ranging from 2.2 to 10.6.

Taconic TSM-DS3 High Frequency Sheet Parameters

Taconic TSM-DS3 is a thermally stable, industry-leading low loss (Df = 0.0011 at 10 GHZ) epoxy that can be fabricated with optimum predictability and consistency of glass fiber reinforced epoxy. Taconic TSM-DS3 is a ceramic-filled reinforcement with a very low glass fiber content (~5%) comparable to epoxies used in the fabrication of large, complex multilayers. membranes.

Taconic TSM-DS3 was developed for high power applications (thermal conductivity = 0.65 W/M * K) where the dielectric material must conduct heat away from other heat sources in the PWB design. Taconic TSM-DS3 was also developed with an extremely low coefficient of thermal expansion to meet demanding thermal cycling requirements.

The Taconic TSM-DS3 core, combined with Taconic fast Rise™ 27 (Df = 0.0014,10 GHz) prepreg, is an industry-leading solution for achieving the lowest dielectric loss at epoxy-like manufacturing temperatures of 420˚F. The low insertion loss of Taconic TSM-DS3 / fast Rise™ 27 can only be achieved by fusion bonding (melting pure Teflon® laminates from 550˚F to 650˚F). Fusion bonding is expensive, causes excessive material movement and puts pressure on plated through holes. For complex multilayers, the low throughput pushes up the final material cost. Fast Rise™ 27 enables sequential lamination of TSM-DS3 at temperatures as low as 420˚F with consistency and predictability, reducing costs.

For microwave applications, low x, y, and z CTE values ensure very low temperature shift in the critical spacing between traces in filters and couplers. Taconic TSM-DS3 can be used with very thin copper foils to produce smooth copper edges between coupling lines.

Alignment on multiple layers is critical for yield and copper weight variations, and copper etching on panels can lead to nonlinear movement. Non-linear movement on large panels results in drilled holes that do not align with the pad and possible open circuits.

A. The Taconic TSM-DS3 is compatible with Ticer® and Ohmega Ply® resistor foils.

B. The Taconic TSM-DS3 has a dielectric constant deviation of +/- 0.2% from temperature.

C. Loss factor varies between 0.0007 - 0.0011 over the typical application temperature range.

D. Insertion loss comparison between TSM-DS3 and synthetic rubber hydrocarbon laminates.

E. Benefits and Applications:

1. a, Best Df in the industry (Df = 0.0011 @ 10 GHz).
2. b, High thermal conductivity (0.65 W / M * K).
3. c, Low glass fiber content (~5%).
4. d, Dimensional stability comparable to epoxy resin.
5. e, Enables large format high level counting PWB.
6. f, Build complex PWBs with consistency and predictability.
7. g, Temperature stabilized Dk +/- 0.25% (-30 to 120°C).
8. h, Compatible with resistive foils.
9. i, Coupler.
10. j, Phased array antennas.
11. k, Radar streamers.
12. l, mm Wave antennas/automotive.
13. m, Oil Drilling.
14. n, Semiconductor/ ATE Testing.