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Taconic PCB

RF-35 Taconic PCB Board

Material : Taconic RF-35

Layer : 2L

DK : 3.48

Finished Thickness : 0.8MM

Coppper Thickness : 10Z

Dielectric Thickness : 0.76mmThermal Conductivity : 0.69w/m.kSurface Treatment : Immersion TinApplication : Communication PCB

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


High Frequency PCB

High frequency board refers to special circuit boards with high electromagnetic frequency, used in the field of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meters) PCB, is a circuit board produced by using part of the process of the manufacturing method of ordinary rigid circuit boards or by using a special treatment method on the copper-clad laminated boards of the microwave substrate. Generally speaking, high-frequency board can be defined as the frequency of 1GHz or more circuit boards.

High frequency PCB boards are characterized by their excellent transmission performance in high-frequency operating environments. At the same time, the board thickness of high-frequency boards is thinner, and the line width and line spacing are finer than those of ordinary PCB circuit boards. In addition, the dielectric constant of high-frequency boards is particularly small, so it can reduce signal loss and improve signal transmission rate and reception sensitivity. High-frequency PCB boards generally use materials such as RO4350B, RO4003C and F4B.

PCB high frequency board material classification:

A. To Material Points:

a, Organic materials: phenolic resin, glass fiber / epoxy resin, Polyimide, BT / Epoxy and so on belong to it;

b, Inorganic materials: aluminum, Copper-invar-copper, ceramic and so on belong to. Mainly take its heat dissipation function;

B. The Distinction Between Hard and Soft Products:

a, Rigid PCB;

b, Flexible PCB;

c, Rigid-Flex PCB.

C. To Structure Points:

a, Single-sided board;

b, Double-sided board;

c, Multi-layer board.

D.  According to the Use of Points:

Can be divided into: communications, consumable electronics, military, computers, semiconductors, electrical test boards…

We specialize in rapid prototyping and small to medium volume production of 2-36 layer high frequency microwave RF induction printed circuit boards. We produce environmentally friendly printed circuit boards with high frequency, high precision and high density. Our main products include HF PCB circuit boards, Rogers HF circuit boards, Teconic HF circuit boards, F4B/Teflon HF circuit boards, Microwave RF circuit boards, Specialty circuit boards and more. We are a strong manufacturer of high quality HF circuit boards. Please feel free to inquire if you need any further information.

Process Capability Parameters

Sequence  Number ProjectParameters
1Materials Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2Maximum Layer sample 36L/Batch 28L
3Maximum Plate ThicknessSamples 8.0mm/Batch 6.0mm
4Thinnest Plate Thickness2L-0.1mm
5Maximum Panel Size1200 * 610mm
6Minimum Line Width Line Spacing0.075mm (3mil)
7Minimum Pad Spacing0.1mm (4mil)
8Completed Aperture0.15mm-6.3mm
9Hole Wall Copper Thickness> 25um (1mil)
10Appearance Tolerance ± 0.1mm (4mil)
11Impedance Tolerance± 10%
12PTH Aperture Tolerance± 0.075mm (3mil)
13NPTH Hole Tolerance± 0.05mm (2mil)
14Hole Position Deviation± 0.05mm (2mil)
15Minimum Blind Buried Hole0.1mm (4mil)
16Plate Bending and Warping ≤ 0.7%
17Outer Copper Thickness 1oz-5oz
18Lnner Layer Copper Thickness1/2oz-4oz
19Outer Copper Thickness 12:01
20SMT Minimum Green Oil Width0.08mm
21Minimum Green Oil Window Opening0.05mm
22Special ProcessThick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23Surface Treatment ProcessesInclude OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.


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