High Frequency Taconic PCB

PCB Thickness : 0.1mm-12mm;

Copper Thickness : 0.5oz-3oz;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

INQUIRY

A. Taconic sheet characteristics:

a, Taconic is an organic ceramic laminate in Taconic product ORCER;

b, it is a reinforced glass material based on fiberglass cloth, a combination of TACONIC's ceramic filling technology and glass fiber coated PTFE technology;

c, Taconic is the best choice for low-cost, high-volume commercial microwave and radio frequency applications;

d, Taconic 's 1/20Z and 10Z copper-clad boards have excellent peel strength even with standard epoxy materials and are readily available for rework;

e, RF's glass transition temperature - 35, over 315°C;

f, Taconic 's ultra-low absorption and low loss factor minimizes phase shift over the frequency range;

g, dimensional stability Taconic is due to the use of glass fiber cloth in its design development;

h, Taconic lamination materials, generally using single-sided or double-sided 1/20Z, 10Z and 20Z thickness of electrolyte copper foil. Different sizes of sheets are available upon request.

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B. Application Areas:

a, Power amplifiers;.

b, Filters and connectors;.

c, Passive components.

Process Capability Parameters

Sequence	Number Project	Parameters
1	Materials	Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2	Maximum	Layer sample 36L/Batch 28L
3	Maximum Plate Thickness	Samples 8.0mm/Batch 6.0mm
4	Thinnest Plate Thickness	2L-0.1mm
		4L-0.4mm
		6L-0.6mm
		8L-0.8m
		10L-1.0mmm
5	Maximum Panel Size	1200 * 610mm
6	Minimum Line Width Line Spacing	0.075mm (3mil)
7	Minimum Pad Spacing	0.1mm (4mil)
8	Completed Aperture	0.15mm-6.3mm
9	Hole Wall Copper Thickness	＞ 25um (1mil)
10	Appearance Tolerance	± 0.1mm (4mil)
11	Impedance Tolerance	± 10%
12	PTH Aperture Tolerance	± 0.075mm (3mil)
13	NPTH Hole Tolerance	± 0.05mm (2mil)
14	Hole Position Deviation	± 0.05mm (2mil)
15	Minimum Blind Buried Hole	0.1mm (4mil)
16	Plate Bending and Warping	≤ 0.7%
17	Outer Copper Thickness	1oz-5oz
18	Lnner Layer Copper Thickness	1/2oz-4oz
19	Outer Copper Thickness	12:01
20	SMT Minimum Green Oil Width	0.08mm
21	Minimum Green Oil Window Opening	0.05mm
22	Special Process	Thick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23	Surface Treatment Processes	Include OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.