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Taconic PCB

High Frequency Taconic PCB

PCB Thickness : 0.1mm-12mm;

Copper Thickness : 0.5oz-3oz;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


A. Taconic sheet characteristics:

a, Taconic is an organic ceramic laminate in Taconic product ORCER;

b, it is a reinforced glass material based on fiberglass cloth, a combination of TACONIC's ceramic filling technology and glass fiber coated PTFE technology;

c, Taconic is the best choice for low-cost, high-volume commercial microwave and radio frequency applications;

d, Taconic 's 1/20Z and 10Z copper-clad boards have excellent peel strength even with standard epoxy materials and are readily available for rework;

e, RF's glass transition temperature - 35, over 315°C;

f, Taconic 's ultra-low absorption and low loss factor minimizes phase shift over the frequency range;

g, dimensional stability Taconic is due to the use of glass fiber cloth in its design development;

h, Taconic lamination materials, generally using single-sided or double-sided 1/20Z, 10Z and 20Z thickness of electrolyte copper foil. Different sizes of sheets are available upon request.


B.  Application Areas:

a, Power amplifiers;.

b, Filters and connectors;.

c, Passive components.

Process Capability Parameters

Sequence  Number ProjectParameters
1Materials Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2Maximum Layer sample 36L/Batch 28L
3Maximum Plate ThicknessSamples 8.0mm/Batch 6.0mm
4Thinnest Plate Thickness2L-0.1mm
5Maximum Panel Size1200 * 610mm
6Minimum Line Width Line Spacing0.075mm (3mil)
7Minimum Pad Spacing0.1mm (4mil)
8Completed Aperture0.15mm-6.3mm
9Hole Wall Copper Thickness> 25um (1mil)
10Appearance Tolerance ± 0.1mm (4mil)
11Impedance Tolerance± 10%
12PTH Aperture Tolerance± 0.075mm (3mil)
13NPTH Hole Tolerance± 0.05mm (2mil)
14Hole Position Deviation± 0.05mm (2mil)
15Minimum Blind Buried Hole0.1mm (4mil)
16Plate Bending and Warping ≤ 0.7%
17Outer Copper Thickness 1oz-5oz
18Lnner Layer Copper Thickness1/2oz-4oz
19Outer Copper Thickness 12:01
20SMT Minimum Green Oil Width0.08mm
21Minimum Green Oil Window Opening0.05mm
22Special ProcessThick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23Surface Treatment ProcessesInclude OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.


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