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Rogers PCB

Rogers TMM 6 High Frequency PCB


Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers.

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Rogers TMM 6 microwave high frequency board circuit board material has an isotropic dielectric constant (Dk). Like other TMM series materials, Rogers TMM 6 combines many of the desirable properties of ceramic and PTFE substrates and can utilize simple flexible board processing techniques.

Rogers TMM 6 Thermoset Microwave HF Board Circuit Board Material is a composite of ceramic, hydrocarbon thermoset polymers Rogers TMM 6, HF Board Circuit Board Material can be supplied with a wide range of different dielectric constants and copper cladding types designed for ribbon and microstrip line applications with high reliability plated through-hole requirements.

The electrical and mechanical properties of Rogers TMM 6, HF board circuit board material combine many of the advantages of ceramic and conventional PTFE microdermabrasion laminates so that no special production processes are required for manufacturing. Rogers TMM 6 laminates do not require sodium naphthalene treatment prior to chemical plating.

Rogers TMM 6 <a class='inkey' href='https://www.szxcepcb.com/Aviation-pcb/taconic-rf-35-aviation-high-frequency-pcb' target='_blank'>High Frequency PCB</a>

Rogers TMM 6 laminates have an extremely low thermal temperature coefficient of dielectric constant, typically less than 30 ppm/oc, and an isotropic coefficient of thermal expansion that is very close to that of copper, which results in highly reliable plated through holes and very low etch shrinkage values for TMM laminates.

In addition, TMM 10i laminates have twice the thermal conductivity of traditional PTFE/ceramic laminates, allowing for easy heat dissipation. Rogers TMM 6 HF board circuit board materials are thermoset resin-based composites that do not soften during heating. As a result, the wiring connections between components and circuits can be left intact without fear of pad removal or material deformation.

Rogers TMM 6 HFPC combines many of the characteristics of ceramic materials while minimizing the need for special handling of soft materials during processing. Rogers TMM 6 laminates can be supplied with 1oz to 2oz electrolytic copper foils or directly bonded to brass or aluminum substrates. Material thicknesses range from 0.015" to 0.500". Resistant to the effects of etchants and dissolvers in the printed circuit fabrication process. Therefore, all common PCB processes can be used for processing Rogers TMM 6 thermoset microwave materials.

Characteristics

a, Dk 6.3+/-.0.050;

b, Df.0023 10GHz;

c, TCDk-43 ppm/°K;

d, Coefficient of thermal expansion matches copper;

e, Product thickness range: .0015 to .500 inches +/-.0015"。

Advantages

a, Excellent mechanical properties against creep and cold distortion;

b, Good resistance to chemicals used in the manufacturing process, minimizing damage during fabrication;

c, Material does not need to be treated with sodium naphthalene prior to chemical plating

d, Reliable lead bonding based on thermosetting resins.

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