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Rogers PCB

Rogers RO4003C PCB

Dk is 3.38 +/- 0.05

Loss factor 0.0027 at 10 GHz

Low Z-axis thermal expansion coefficient at 46 ppm/°C

Ideal for multilayer board (MLB) construction

Processes such as FR-4 are cheaper to manufacture

Designed for performance-sensitive, high-volume applications


RO4003C laminate is available in various configurations in 1080 and 1674 fiberglass styles, all meeting the same laminate electrical performance specifications. RO4003C laminates offer tightly controlled dielectric constant (Dk) and low losses while using the same processing methods as standard epoxy/glass at a fraction of the cost of traditional microwave laminates. Unlike PTFE-based microwave materials, no special via preparation or handling procedures are required.

RO4003C material is non-brominated and does not meet the UL 94 V-0 rating. For applications or designs that require a UL 94 V-0 flammability rating, RO4835™ and RO4350B™ laminates do meet this requirement.

Rogers RO4003C is another high frequency circuit board material produced by Rogers Corporation. Like RO4350B, it is designed for high-performance wireless and radar applications. The following are some key parameters and features of RO4003C:

Dielectric Constant (Dk): 

RO4003C has a dielectric constant of 3.38 and a tolerance of ±0.05, providing low dielectric loss characteristics.

Loss Tangent (Df): 

The loss tangent at 10 GHz is 0.0027, which indicates that the material has very low signal attenuation.

Material Composition: 

RO4003C is a proprietary glass cloth reinforced, ceramic filled hydrocarbon composite material that combines the electrical properties of PTFE/glass cloth with the processability of epoxy/glass cloth.

Coefficient of Thermal Expansion (CTE): 

RO4003C has a Z-axis thermal expansion coefficient of 46 ppm/°C, which is similar to copper materials and provides excellent dimensional stability.


Glass Cloth Configuration: 

The RO4003C is available in two different glass cloth configurations, using 1080 and 1674 different glass cloths, but all configurations have the same electrical performance specifications.

Thermal Properties: 

RO4000 series materials have a glass transition temperature (Tg) greater than 280°C (536°F) and maintain stable dimensions throughout the circuit processing range.

Processing Compatibility: 

RO4003C is fully compatible with traditional PCB manufacturing technology and does not require special pre-processing processes, such as pre-processing for through-hole copper plating or plasma treatment for PTFE sheets.

Cost Effective: 

Same process as standard epoxy/glass processing, but at a much lower cost than traditional microwave laminates.

Flame Retardant Rating: 

It should be noted that RO4003C material is not brominated and therefore cannot meet the UL 94V-0 flame retardant rating standard. If the application or design requires a UL 94V-0 flame retardant rating, consider using RO4835™ or RO4350B™ high frequency boards.

Typical Applications: 

RO4003C is suitable for a variety of high-performance electronic applications, including microstrip lines, cellular base station antennas, automotive radars and sensors, point-to-point microwave communications, power amplifiers and RFID antennas, etc.

Inventory status: 

The material thickness of Rogers-RO4003C high-frequency board in regular inventory of Borui Circuit Company includes 8mil, 12mil, 16mil, 20mil, 32mil and 60mil.

Electrical Properties: 

RO4003C material exhibits stable electrical properties at different frequencies, which is very important for designing high-performance radio frequency circuits.

Mechanical Properties: 

The material has good mechanical strength to provide physical support and durability.


Processing Technology: 

Since the processing technology of RO4003C and FR-4 materials is similar, it is easy to produce in large quantities and can be multi-layer mixed.


While maintaining high performance, RO4003C is cheaper than traditional microwave material laminates and has a great price competitive advantage.

Design Flexibility: 

The material’s low Z-axis thermal expansion coefficient helps reduce dimensional changes due to temperature changes, thereby increasing design flexibility.

Application Fields: 

RO4003C is suitable for a variety of high-performance electronic applications, including but not limited to wireless communications, radar systems, automotive electronics, aerospace and military applications.

Environmental Adaptability: 

Due to its high glass transition temperature (Tg), RO4003C can adapt to harsh thermal shock environments and ensure the reliability of circuit boards.

Supply Chain: 

Rogers Company cooperates with authorized laminators around the world and stocks RO4003C core materials and prepregs in various thicknesses to ensure the stability of the supply chain.

Environmentally Friendly Properties: 

RO4003C material is not brominated and therefore does not have a UL 94V-0 flame retardant rating, but it is an environmentally friendly option for applications that do not require this flame retardant rating.

Alternative Materials: 

For applications requiring a UL 94V-0 flammability rating, alternative materials such as RO4835™ or RO4350B™ may be considered.

As a high-performance PCB material, RO4003C balances electrical performance, processing convenience and cost-effectiveness, and is one of the preferred materials for many designers of high-performance electronic equipment.


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