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Rogers RO40003 High Frequency PCB

Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


RO40003® family of materials containing hydrocarbon resins and ceramic fillers, RO4835 laminates provide excellent high frequency performance as well as low line processing costs.

When circuits operate at frequencies above 500 MHz, the design engineer's choice of boards is significantly reduced. ro40003 series materials have the attributes required by RF microwave circuit design engineers to easily design circuits, such as network matching, impedance control of transmission lines, etc. Ro40003 series boards have low dielectric loss, which allows them to be used at higher operating frequencies where traditional board materials cannot be used. The Ro4000 series has a coefficient of thermal expansion (CTE) close to that of copper, which provides many benefits to circuit designers. It offers improved dimensional stability. This property is beneficial for mixed-pressure circuit board construction. The low Z-axis CTE of Ro4000 series boards ensures the quality of the metallized vias, even in severe thermal shock applications. the Tg of RO40003 series boards is greater than 536°F (280°C), so their thermal expansion characteristics remain stable over the entire circuit processing temperature range.

Rogers RO4000 <a class='inkey' href='' target='_blank'>High Frequency PCB</a>

Key Benefits

a, 10 times higher oxidation resistance compared to traditional thermoset materials;

b, Excellent electrical properties enable to meet higher operating frequency applications;

c, No bubbles or delamination;

d, Reliable plating of through holes;

e, Stable over the entire circuit processing temperature range.

Typical Applications

a, Automotive radar and sensors;

b, Point to point microwave transmission;

c, Amplifiers;

d, Phased array radar;

e, Radio frequency components.


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