Rogers RO3006 Mircowave PCB Board
Layer : 4 Layer
DK :6
Dielectric Thickness : 0.65mm
Thermal Conductivity : 0.68w/m.k
Surface Treatment : Immersion Gold
Trace / Spacing : 4mil/4mil
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.
Rogers RO3006™ laminates are ceramic-filled PTFE composites dedicated to providing excellent electrical performance and mechanical stability.
RO3006™ laminate advanced line material maintains a balanced dielectric constant (Dk) over a wide range of ambient temperatures. At the same time, it removes the step change in dielectric constant that occurs with conventional PTFE materials at room temperature.
A. Characteristics
- a, Dk6.15+/-.15;
- b, Df.0020@10GHz;
- c, Low X-, Y- and Z-axis CTEs of 17, 17 and 24 ppm/°C, respectively.
B. Advantages
Same mechanical properties as RO3000™ series laminates for multilayer designs
C. Cost Effective
Rogers provides high frequency, high speed and high power semiconductor materials to customers worldwide in wireless infrastructure, power amplifiers, radar systems, high speed digital, hybrid vehicles, high voltage rail transportation traction, laser systems, and wind and solar energy conversion.