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Rogers PCB

Rogers RO3006 Immersion Gold RFPCB

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm

Inner Core Thickness: 0.1-4.0mm

Inner Layer Trace/Space: 2.5mil/3mil


Rogers RO3006 is a high frequency circuit board material with the following functions and features:

Stable Electrical Performance: 

RO3006 material is a ceramic-filled PTFE (polytetrafluoroethylene) composite material that maintains a stable dielectric constant (Dk: 6.15 +/- 0.15) and loss factor (Df: 0.0020 @ 10GHz) at an operating frequency of 10GHz, even in the temperature range of -50℃ to +150℃.

Eliminate Dielectric Constant Step Changes: 

Compared with conventional PTFE materials, RO3006 eliminates the step change of dielectric constant at room temperature, providing more consistent electrical characteristics.

Stable Mechanical Properties: 

RO3006 has the same mechanical properties as RO3000 series laminates, suitable for mixed design with epoxy glass cloth FR4 multilayer board circuits.

Low Thermal Expansion Coefficient: 

RO3006 has low thermal expansion coefficients X/Y/Z (17/17/24 ppm/℃), which makes the material have excellent dimensional stability under temperature changes, especially in the Z-axis direction, ensuring the stability of electroplated through holes.

High Reliability: 

Due to its close thermal expansion coefficient to copper, RO3006 can achieve more reliable surface mounting and is an ideal material for devices that are sensitive to temperature changes.

Wide Application: 

RO3006 is widely used in commercial microwave RF fields, such as automotive electronic millimeter wave radar, global positioning system satellite antenna, power amplifier and antenna of cellular communication system, patch antenna of wireless communication, direct broadcast satellite, data link of wired system, remote meter reading and power backplane, etc.

Processing Compatibility: 

RO3006 is compatible with a variety of alignment systems with and without pins, suitable for different processing processes, including graphic transfer, pressing, drilling, metallized hole process, etc.

Excellent Thermal Stability: 

Due to its ceramic filling characteristics, RO3006 can maintain its electrical and mechanical properties at high temperatures, suitable for electronic equipment that needs to work in harsh temperature environments.

High Frequency Applications: 

RO3006 is designed for high frequency applications and can support frequencies up to 77 GHz, making it suitable for modern high-speed communications and high-frequency electronic devices.

Excellent Mechanical Properties: 

The excellent mechanical properties related to temperature make RO3006 stable under different environmental conditions, suitable for manufacturing multi-layer boards that need to withstand temperature changes.

Uniform Mechanical Properties: 

Regardless of the dielectric constant selected, the mechanical properties of RO3006 remain consistent, which helps designers develop multi-layer board designs using materials with different dielectric constants without warping or reliability issues.

Low Dielectric Loss: 

RO3006 has low dielectric loss, which is important for RF and microwave applications that require high Q values.

Stable Dielectric Constant: 

The dielectric constant of RO3006 is very stable with respect to temperature and frequency, which is critical for manufacturing high-performance bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.

Low In-Plane Expansion Coefficient: 

The low in-plane expansion coefficient matched to copper helps improve the reliability of surface mount components and is ideal for applications that are sensitive to temperature changes.


RO3006 uses a batch production process, providing a competitive price, making high-performance high-frequency circuit board materials more affordable.

Easy to Process: 

RO3006 can be processed using standard PTFE circuit board processing techniques with only minor modifications, which simplifies the manufacturing process and reduces costs.

Multiple Applications: 

In addition to commercial microwave and RF applications, RO3006 is also suitable for automotive radar, GPS antennas, cellular communication systems, wireless communication patch antennas, direct broadcast satellites, data links, remote meter reading and power backplanes.


What are the Production Precautions?

When producing Rogers RO3006 RFPCB, the following important precautions need to be considered to ensure the best performance and processing quality of the material:

Thermal Stability: 

Due to the excellent thermal stability of RO3006, the temperature should be strictly controlled during the production process to maintain its electrical and mechanical properties.

Stability of Dielectric Constant: 

The dielectric constant of RO3006 is very stable within a certain temperature range, and conditions that may cause changes in the dielectric constant should be avoided during production.

Low Thermal Expansion Coefficient: 

The thermal expansion coefficient of the material is low, similar to that of copper, which helps to improve dimensional stability. During the design and production of multilayer boards, attention should be paid to maintaining consistency between layers.


The machining of RO3006 should use appropriate tools and parameters to avoid excessive mechanical stress that causes material damage.


During the drilling process, it is recommended to use carbide drill bits and control the appropriate feed rate and retract rate to reduce burrs and maintain the quality of the hole wall.

Metalized Holes: 

Before metallizing holes (such as electroplating), the hole wall needs to be activated to ensure good metal adhesion.

Cleaning and Baking: 

Before lamination, the inner core board needs to be baked at 110°C-125°C for a certain period of time to remove volatile substances. At the same time, ensure that the cleaning process does not reduce the bonding strength of the copper oxide treatment layer.


During the lamination process of multilayer boards, appropriate lamination procedures and conditions should be set according to the selected bonding sheet.

Graphic Transfer: 

Dry film or liquid photosensitive film can be used for graphic transfer. Pay attention to using potions compatible with FR4 boards.

Chemical Treatment: 

When performing chemical treatment (such as degumming and oxidation treatment), chemical agents and treatment conditions suitable for RO3006 should be selected.

Final Surface Treatment: 

Before printing the solder mask, the board needs to be thoroughly cleaned and baked to ensure the adhesion of the solder mask.

Environmental Control: 

The production environment should control humidity and temperature to avoid moisture absorption or other environmental factors.

Storage Conditions: 

RO3006 materials should be stored in a dry, cool, dust-free environment and follow the first-in-first-out principle.

Sample Testing: 

Before mass production, sample testing is performed to verify the production process and the performance of the final product.

Technical Support: 

During the production process, if you encounter technical problems, you can contact the technical support of Shenzhen Xinchenger Electronics Corporation for help.


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