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Rogers PCB

Rogers RO3003G2 High Frequency Circuit Board

Thickness: 0.1-12mm

Coper Foil Thickness: 0.5oz-5oz

Max Panel Size: 480*800mm

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm


Rogers RO3003 is a high-performance high frequency PCB material with some of the following key characteristics and properties:

Stable Dielectric Constant: 

With a dielectric constant of 3.00, RO3003 is extremely temperature stable, with a thermal stability coefficient (Z-direction) of up to -3ppm/°C even over the temperature range of -50°C to +150°C.

Low Dielectric Loss: 

At 10GHz frequency, RO3003 has a very low dielectric loss of 0.0013, which helps to minimize the loss during signal transmission.

Mechanical Stability: 

RO3003 maintains a high level of mechanical stability, which makes it suitable for manufacturing PCBs that require precision machining.

Coefficient of Thermal Expansion: 

RO3003 has a coefficient of thermal expansion in the X/Y direction of 17/16 ppm/°C, which is comparable to the coefficient of thermal expansion of copper, and exhibits excellent dimensional stability.

High Frequency Applications: 

Suitable for high frequency applications such as automotive millimeter-wave radar, advanced assisted driving systems (ADAS), and 5G wireless infrastructure.

Optimized Resin and Filler Content: 

RO3003G2 is an enhanced version of RO3003, optimized for millimeter-wave automotive radar applications, with lower insertion loss and smaller dielectric constant variation.

Extremely Low Profile Electrolytic Copper Foil: 

RO3003G2 utilizes an extremely low roughness electrolytic copper foil material to further reduce insertion loss.

Advanced Specialty Fillers: 

The use of advanced specialty fillers with smaller particles allows circuit designs to have higher density/smaller diameter microvias.

Standard Sizes and Thicknesses: 

The Rogers RO3003G2 is available in standard sizes and two dielectric thickness options of 0.005 and 0.010 inches.

Processing Technology: 

RO3003G2 high frequency PCB materials can be made into printed circuit boards using standard PTFE circuit board processing techniques.

Frequency Stability: 

RO3003 maintains a high dielectric constant frequency stability over a wide frequency range.

Low Insertion Loss: 

RO3003G2 shows very low insertion loss, e.g. 1.3 dB/inch, for 5 mil laminates, measured by microstrip differential phase length method.

Optimized Resin System: 

RO3003G2 uses an optimized resin system, which in combination with the very low roughness electrolytic copper foil material, reduces the variation of the dielectric constant during the PCB machining process.

Higher Density/Smaller Diameter Microvia Design: 

The use of advanced special fillers with smaller particles allows circuit designs to have higher density/smaller diameter microvias.

Multiple Applications: 

Suitable for a variety of automotive electronic applications such as adaptive cruise control, forward collision warning, active brake assist, lane change assist, traffic jam navigation, self-parking, blind spot detection, and more.

Dimensional Stability: 

Typical value of RO3003 material shrinkage due to etching (baking after etching) is less than 0.5mils/inch, showing excellent dimensional stability.

Plated Through-Hole Stability: 

The CTE in the Z-direction is 25 (ppm/°C) even in severe temperature environments, ensuring the stability of plated through-holes.

Multiple Dielectric Constants: 

The RO3003 series offers a wide range of dielectric constant options to meet the needs of different applications.

Technical Documentation Support: 

Rogers provides detailed datasheets and manufacturing guidelines to help designers and manufacturers better utilize these materials.

Brand Reputation: 

Rogers is a well-known supplier of high-performance materials with an excellent reputation and quality assurance in the industry.

These performance characteristics make Rogers RO3003 one of the materials of choice in the design and manufacture of high-frequency PCBs with high performance and reliability requirements.


When processing Rogers RO3003 HF PCBs, attention needs to be paid to the following aspects to ensure the performance and quality of the final product:

Material Selection: 

Select the appropriate RO3003 material, such as RO3003G2 which is an enhanced version for millimeter wave radar applications with a more optimized resin and filler system.

Drilling Accuracy: 

Maintain high precision drilling to ensure the quality and dimensional accuracy of the over-hole.

Minimum Line Width/Line Spacing: 

Minimum line width and line spacing are controlled to meet the fine alignment requirements of high frequency circuits.

Surface Treatment: 

Adopt appropriate surface treatment process, such as gold immersion, silver immersion, tin immersion, etc., in order to adapt to the requirements of high-frequency signal transmission.

Mixed-pressure Technology: 

master mixed-pressure technology, such as FR4 and ROGERS / Rogers, PTFE and other materials mixed use.

Automated Production Equipment: 

Use advanced automated production equipment, such as fully automatic exposure machines, LDI, AOI, etc., to improve production efficiency and reduce human error.

Quality Control: 

Strict quality control processes, such as IPC standards, are implemented to ensure high product reliability and stability.

Temperature Cycling Test: 

Temperature cycling test is performed to ensure the performance of the material under extreme temperature.

Fusion Bonding Process: 

If multilayer boards are required, consider using the Fusion Bonding process to achieve highly reliable and homogeneous multilayer boards.

Material Characterization Understanding: 

Familiarize yourself with RO3003 material properties such as dielectric constant, loss factor, coefficient of thermal expansion, etc. to make the best decisions during design and processing.

Environmental Control: 

Control environmental conditions such as temperature and humidity during processing to minimize the impact on material properties.

Technical Documentation: 

Refer to the technical documentation and manufacturing guidelines provided by Rogers Corporation to ensure proper processing steps and parameters are followed.

Specialized Training: 

Ensure that operators are properly trained on the special requirements and processing techniques for HF PCB materials.

Our company specializes in high frequency PCB for many years, there are quite professional factory production hardware equipment experienced team, We can provide high-performance, high-difficulty high-frequency PCB, F4B PCB, RF PCB, perennial equipped with Rogers, Taconic, F4B, Zhongying and other high-performance boards. If you need, please feel free to inquire!


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