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Rogers PCB

Rogers High Frequency PCB


Line Width : 4MIL ;

Line Spacing : 3.5MIL ;

Drilling Diameter : = 3mm ;

Processing Size : 500 * 1200mm

Plate Thickness : 1mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

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Rogers High Frequency PCB Board Material TC Series Laminate Features

High Frequency PCB Boards: are special circuit boards with higher electromagnetic frequencies. Generally speaking, high-frequency can be defined as the frequency above 1GHz. Its various physical properties, precision, technical parameters require very high, commonly used in automotive collision avoidance systems, satellite systems, radio systems and other fields. High-frequency PCB boards realize high-frequency signal transmission circuit boards. The technology is designed with high-speed transmission, low noise, high precision and other characteristics, widely used in wireless communications, aerospace, medical equipment and other fields.

A. TC® Series Laminates

Rogers TC Series laminates are PTFE materials with glass fiber reinforcement and high thermal conductivity ceramic fillers that provide improved PCB thermal management for applications requiring high power RF signals. The material's low loss, high thermal conductivity, low coefficient of thermal expansion, and excellent temperature phase stability provide excellent performance and reliability in high power applications. The TC series materials are well suited for applications that are sensitive to changes in dielectric constant (Dk) with temperature, including power amplifiers, filters, couplers, etc. The TC series laminates are also available in a wide range of materials, such as ceramics and ceramics, and can be used in a variety of applications.

  1. a, Advantages
    Lower junction temperature for improved reliability;
    Improved bandwidth utilization and efficiency of amplifiers and antennas;
    Improved active element and plated vias connection reliability;
    Size optimization can help PCB converters improve processing flexibility.

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B. TC350™ Laminates

Rogers TC350 laminates are highly thermally conductive ceramic-filled, glass cloth reinforced PTFE composite PCB materials. It offers designers a unique combination of low insertion loss and higher thermal conductivity. This allows for superior reliability and lower operating temperatures in high power applications.

  1. a, Characteristics
    Dielectric constant (DK) 3.5;
    Thermal conductivity 0.72 W/m-K;
    TCDk -9 ppm/°C (-40°C ~ 140°C);
    Df .002@10 GHz;
    Low coefficients of thermal expansion in the X, Y, and Z axes (7, 7, and 23 ppm/°C, respectively).
  2. b, Advantages
    Lower junction temperature for improved reliability;
    Excellent thermal conductivity and thermal management;
    Improved bandwidth utilization and efficiency of amplifiers and antennas;
    Excellent plated through-hole reliability.

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C. TC350™ Plus Laminates

Rogers TC350 Plus material is a PTFE printed circuit board material consisting of a high thermal conductivity ceramic filler and reinforced glass fiber cloth.

TC350 Plus materials provide design engineers with a unique combination of low loss (and insertion loss), high thermal conductivity for superior reliability and reduced circuit operating temperatures in high power applications.

  1. a, Characteristics
    Dielectric constant (DK) 3.5;
    Thermal conductivity 1.24 W/m-K;
    TCDk -42 ppm/°C, -40°C ~ 140°C;
    Df .0017@10 GHz;
    Low coefficient of thermal expansion (CTE-z) 38 ppm/°C;
  2. b, Advantages
    Lower junction temperature for improved reliability.;
    Lower transmission line losses and reduced heat generation;
    Improved bandwidth utilization and efficiency of amplifiers and antennas;
    Highly reliable plated through holes;
    CTE can be matched to low voltage soldered active components.

D. TC600™ Laminates

Rogers TC600 laminates are PTFE composites consisting of high thermal conductivity ceramic filler and reinforced glass cloth. It offers best-in-class thermal conductivity and mechanical properties to reduce PCB design size. The increased thermal conductivity helps to increase high power capacity, reduce high temperature hot spots and improve device reliability.

  1. a, Characteristics
    Dielectric constant (DK) 6.15;
    Thermal conductivity 1.0W/m.K.;
    TCDk -75ppm/kg;
    TCDk -75ppm/°C (-40°C ~ 140°C);
    Df .002@10 GHz;
    Low coefficients of thermal expansion in the X, Y, and Z axes (9, 9, and 35 ppm/°C).
  2. b, Advantages
    High dielectric constant reduces PCB size;
    Reduced transmission line losses and heat generation;
    Improved processing and reliability;
    CTE is compatible with low voltage soldered active components.

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