Rogers Circuit Board Customization Factory
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Processing Size : 600 * 1200mm;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36layers;
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc. Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.
RO4835™ laminates are suitable for applications requiring higher stability at elevated temperatures and greater resistance to oxidation than standard RF thermosets. As part of the RO4000® family of materials containing hydrocarbon resins and ceramic fillers, RO4835 laminates provide excellent high frequency performance as well as low line processing costs.
Oxidation affects all thermoset laminates, including FR-4 laminates, over time and with temperature changes. Over the long term, oxidation causes a small increase in the dielectric constant and loss factor of the circuit sheet. The rate of change and impact on circuit performance depends on the specific design and operating temperature. For applications requiring greater stability at elevated temperatures, Rogers has successfully developed Ro4835TM circuit sheet, which can be more stable in high temperature environments, with substantially higher oxidation resistance relative to other RF thermosets, in addition, the electrical and mechanical properties of Ro4835 material are virtually identical to those of the sheet that has been used successfully by our customers for many years, Ro4350BTM. Ro4835, a member of the Ro4000 series hydrocarbon material family, offers excellent high frequency performance and low circuit fabrication costs.
When circuits operate at frequencies above 500 MHz, the design engineer's choice of boards is significantly reduced. ro4000 series materials have the attributes required by RF microwave circuit design engineers to easily design circuits, such as network matching, impedance control of transmission lines, etc. Ro4000 series boards have low dielectric loss, which allows them to be used at higher operating frequencies where traditional board materials cannot be used. The Ro4000 series has a coefficient of thermal expansion (CTE) close to that of copper, which provides many benefits to circuit designers. It offers improved dimensional stability. This property is beneficial for mixed-pressure circuit board construction. The low Z-axis CTE of Ro4000 series boards ensures the quality of the metallized vias, even in severe thermal shock applications. the Tg of RO4000 series boards is greater than 536°F (280°C), so their thermal expansion characteristics remain stable over the entire circuit processing temperature range.
RO4835T™ laminate is a ceramic-filled, low-loss thermoset material using a special open-fiber glass cloth available in 2.5 mil, 3 mil and 4 mil thicknesses with a dielectric constant (Dk) of 3.3. Designed for use in the inner layers of multilayer board structures, it is an excellent complement to the RO4835™ material, which needs to be thinner.
In recent years, the continued evolution of global mobile networks, from GSM, to WCDMA and LTE, has enabled users to increase their data streams at a phenomenal rate. Rogers' high-frequency circuit board materials also play a key role in this market. Devices such as antennas, power amplifiers and microwave backhaul are necessary to build these mobile networks, and they all require low-loss materials with stable dielectric constants. High-frequency circuit materials are a key enabling technology for the development of mobile networks, and multilayer designs will be common for next-generation 5G mobile network technologies using millimeter-wave bands. ro4835T laminates offer thin dielectric thicknesses and a wide range of thickness options, and can be used with ro4450F™ semicured sheets, the new ro4450T™ thin semicured sheets, and CU4000™/CU4000LoPro® laminates. CU4000LoPro® copper foil products. When used in conjunction with Ro4835 laminates and Ro4000® bonding materials, these material combinations give designers more flexibility to meet the requirements of high multilayer board (MLB) designs.
Ro4835T laminate has the same oxidation resistance as Ro4835 laminate, and boasts ultra-low loss, excellent dielectric constant tolerance control, and tight thickness control to provide excellent and stable wireless performance for circuits. In addition, its high-performance material properties make it extremely cost-effective and stable.
To enable applications that meet UL 94V-0 requirements, Ro4835 laminates utilize flame retardant technology that is RoHS compliant. These materials meet the requirements of IPC-4103.
a, 10 times higher oxidation resistance compared to traditional thermoset materials;
b, Excellent electrical properties enable to meet higher operating frequency applications;
c, No bubbles or delamination;
d, Reliable plating of through holes;
e, Stable over the entire circuit processing temperature range.
a, Automotive radar and sensors;
b, Point to point microwave transmission;
d, Phased array radar;
e, Radio frequency components.