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Rogers PCB

Rogers 5880 Immersion Gold RF PCB

Thickness: 0.1-12mm

Coper Foil Thic: kness 0.5oz-5oz

Max Panel Size: 480*800mm

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm


The performance characteristics of the 4-layer Rogers 5880 immersion gold RF PCB mainly include the following points:

Material Properties:

Rogers RT/duroid 5880 material is used, which is a polytetrafluoroethylene glass fiber reinforced material.

Dielectric Constant:

At an operating frequency of 10GHz, the dielectric constant (Dk) is 2.20±0.02, which is significantly lower than similar materials on the market and is very important for high-frequency design applications.

Dielectric Loss:

The dielectric loss factor (Df) is measured at 0.0009 at 10GHz. The extremely low dielectric loss helps minimize dispersion and loss, and is suitable for high-frequency and wide-band designs.

Moisture Absorption Rate:

The extremely low moisture absorption rate of only 0.02% makes this material very suitable for applications in high humidity environments.

Processing Performance:

The material is easy to cut into the desired shape and can resist the erosion of solutions and reagents used in etching and through-hole plating.


It has good resistance to solutions and reagents used in etching or plating edges and through-hole processes.

Application Areas:

Suitable for point-to-point digital radio antennas, microstrip and stripline circuits, millimeter wave applications, missile guidance systems, military radar systems, high-frequency circuit boards for commercial aviation telephones, etc.

Processing Technology:

The processing technology is similar to FR-4, but the cost is lower, providing high cost performance and excellent dimensional stability.

Environmental Protection Standards:

Meet the lead-free process standards and are suitable for applications with strict environmental protection requirements.

Minimized Design Specifications:

Minimum drilling 0.3mm, minimum line width 0.35mm, minimum line spacing 0.2mm, these specifications help to achieve high-density circuit design.

High Frequency Support:

Can support applications up to Ku band or even higher frequencies, suitable for the needs of modern high-frequency communication technology.

Good Electrical Performance:

Maintain consistent electrical characteristics over a wide frequency range to ensure the stability and reliability of signal transmission.

Dimensional Stability:

Due to the isotropy of the material, its electrical properties change very little with frequency, ensuring the performance consistency of the circuit board at different frequencies.

Heat Resistance:

Rogers 5880 material has good heat resistance and is suitable for use in higher temperature environments.

Chemical Resistance:

The material is able to resist chemical agents used in the production process, such as etchants and plating solutions.

Mechanical Strength:

Due to the reinforcement of glass fiber, the material has high mechanical strength and is suitable for use in applications that need to withstand certain mechanical stress.

Easy Processing:

The material is easy to cut, drill and other processing operations, which facilitates the realization of complex circuit board designs.

Environmental Stability:

The material is less sensitive to environmental changes (such as temperature and humidity), ensuring reliability under different environmental conditions.

Electromagnetic Compatibility:

Due to low dielectric constant and low dielectric loss, it helps to improve the electromagnetic compatibility of the circuit.

Long-term Reliability:

The long-term stability and durability of the material ensure the reliability of the circuit board in long-term use.


When producing 4-layer Rogers 5880 immersion gold RF PCB, you need to pay attention to the following issues to ensure product quality and performance:

Material Selection:

Ensure the use of genuine Rogers 5880 materials and avoid using counterfeit or inferior materials.

Sheet Thickness Consistency:

Maintain the consistency of sheet thickness to avoid dimensional deviation during processing.

Drilling Accuracy:

Precisely control the drilling size and position to meet the minimized design specifications.

Interlayer Alignment:

Ensure accurate alignment between layers to avoid interlayer misalignment affecting circuit performance.

Immersion Gold Process:

Use high-quality immersion gold process to ensure uniformity and adhesion of gold layer.

Etching Control:

Precisely control etching process to avoid over-etching or under-etching.

Impedance Control:

Strictly control impedance to ensure impedance continuity and matching in circuit design.

Thermal Management:

Pay attention to thermal management during production to avoid changes in material properties due to excessive temperature.

Environmental Control:

Keep the production environment clean and stable to avoid the impact of dust and humidity on products.

Quality Inspection:

Perform quality inspection regularly to ensure that each circuit board meets design and performance requirements.

Electromagnetic Compatibility Test:

Perform electromagnetic compatibility test on finished products to ensure compatibility of products in actual applications.

Stress Test:

Perform stress test to evaluate the reliability of circuit boards under mechanical stress.

Batch Mmanagement:

Strict batch management to ensure consistency and traceability of each batch of products.

Operator Training:

Professional training for operators to ensure that they are familiar with production processes and quality standards.

Equipment Maintenance:

Maintain and calibrate production equipment regularly to ensure the accuracy and stability of the equipment.

Design Rule Check:

Perform design rule check (DRC) before production to ensure that the design meets production requirements.

Process Documentation:

Maintain detailed records of the production process to facilitate problem tracking and continuous improvement.


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