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Rogers PCB

RO4360G2 High Frequency PCB


Dk is 6.15 +/- 0.15

Loss factor as low as 0.0038 at 10 GHz

0.75 W/(m-K) high thermal conductivity

Low Z-axis thermal expansion coefficient at 28 ppm/°C

High Tg greater than 280 °C TMA

Compatible with automatic assembly

Plated through hole reliability

Environmentally friendly—compatible with lead-free processes

Efficient supply chain and short delivery times make material selection cost-effectiv

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RO4360G2 is a high-frequency circuit board material produced by Rogers Corporation. It is a glass fiber reinforced, ceramic-filled hydrocarbon thermoset material.

RO4360G2 laminate is the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to FR-4. These materials feature lead-free process capabilities and provide greater rigidity to improve processability of multilayer board structures while reducing material and manufacturing costs. RO4360G2 laminates are available with RO4400™ Series prepregs and low Dk RO4000® laminates in multi-layer designs.

This material is recognized for its extremely low loss characteristics and good balance between performance and processability. Here are some key features and applications of RO4360G2:

High Dielectric Constant: 

RO4360G2 has a high dielectric constant Dk of 6.15+/-0.15 (at 10 GHz), which allows power amplifier designers to reduce the finished PCB size by approximately 20-30% while reducing the cost caused by the PCB.

Heat Resistance: 

The material is able to withstand larger operating temperatures, helping sheet metal processors achieve higher maximum operating temperature values in UL certification.

Flame Retardant Grade: 

Meets the flame retardant grade requirements of UL 94V-0.

Thermal Conductivity: 

It has a good thermal conductivity of 0.75W/m/K, which helps to improve the reliability of the product.

PCB-98

Thermal Expansion Coefficient: 

Low Z-axis thermal expansion coefficient improves product design flexibility.

Processability: 

RO4360G2 processes similarly to FR-4, is compatible with automated placement, and provides the same reliability and stability as Rogers RO4350B material.

Application Areas: 

Typical applications include power amplifiers, low noise amplifiers, RF components (such as combiners and power dividers), antennas, and as an alternative material to LTCC (low temperature co-fired ceramics).

Dimensional Stability: 

It has good dimensional stability, which is crucial for precision circuit design.

Electrical Strength: 

It has high electrical strength with a value of 784 V/mil.

Optional Sizes: 

Different size options are available, such as 305 x 457mm, 610 x 457mm, 610 x 915mm, 1.224 x 915mm, etc.

Thickness Options: 

Available in multiple thickness options including 0.008", 0.016", 0.024" and 0.060".

Environmental Adaptability: 

The material's low water absorption helps maintain performance under changing environmental conditions.

Surface and Volume Resistivity: 

Features high surface resistivity of 9.0 x 10^12 Mohm-cm and volume resistivity of 4.0 x 10^13 Mohm-cm, which helps reduce leakage on circuit boards and improve signal integrity.

PCB-100

Thermal Coefficient: 

The RO4360G2 has a thermal coefficient of -131 ppm/°C at 10 GHz, which helps maintain circuit performance stability over temperature changes.

Glass Transition Temperature (Tg): 

RO4360G2 sheet has a high glass transition temperature Tg, which is generally related to the thermal stability and long-term reliability of the material.

Compatibility with RO4000 Series: 

RO4360G2 sheet can be mixed with RO4400TM prepreg and other low dielectric constant RO4000 series materials, providing flexibility for multi-layer board design.

Environmental Adaptability: 

Due to its low water absorption and good thermal properties, RO4360G2 is suitable for applications in various environmental conditions.

Electrical Properties: 

In addition to a high dielectric constant, RO4360G2 has excellent electrical properties, including low dissipation factor and good electrical strength.

Mechanical Properties: 

The sheet’s bending strength and heat resistance make it well suited for applications with high mechanical requirements.

Processing Technology: 

The processing technology of RO4360G2 is similar to that of FR-4, which means it can be used in existing PCB production facilities without the need to invest heavily in new equipment or change the production process.

Cost-Effectiveness: 

While the material itself may be more costly, the design advantages brought by its high dielectric constant can reduce PCB size and material usage, thus reducing overall system costs.

Lead-free Soldering Compatible: 

The plate meets the requirements of lead-free soldering processes and complies with current environmental protection and health and safety standards.

Application Innovation: 

The high dielectric constant characteristics of RO4360G2 make it particularly useful in the design of new generation power amplifiers, helping to achieve smaller designs.

Technical Documentation: 

Rogers Company provides detailed technical documentation and data manuals to help designers and engineers better understand and use RO4360G2 sheets.

These features make RO4360G2 an ideal choice for 4G communications, aerospace, and other high-performance electronic applications.

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