RO3200 Series High Frequency PCBs

Dielectric Constant (Dk):

RO3203: 3.02±0.04

RO3206: 6.15±0.15

RO3210: 10.2±0.50

Depletion Factor (Df):

RO3203: 0.0016 (at 10 GHz)

RO3206: 0.0027 (at 10 GHz)

RO3210: 0.0027 (at 10 GHz)

Coefficient of Thermal Expansion (CTE, ppm/°C):

RO3203: X/Y/Z axis -13/-13/58

RO3206: X/Y/Z axis -13/-13/34

RO3210: X/Y/Z axis -13/-13/34

Water Absorption Rate:0.1%

Fire Rating:UL 94V-0

Dimensional Stability:0.8 mm/m for RO3203, RO3206 and RO3210.

Volume Resistivity:For all three materials, volume resistivity is 10^7 MW-cm.

Surface Resistivity:Again, for all three materials, the surface resistivity is 10^7 MW.

Copper Peel Strength:

RO3203: 10.2 pli

RO3206: 10.7 pli

RO3210: 11.0 pli

Color: 

RO3203 and RO3206 are typically brown (Tan), while RO3210 is off white.

Density:

RO3203: 2.1 gm/cm³

RO3206: 2.7 gm/cm³.

RO3210: 3.0 gm/cm³.

These laminates maintain stable dielectric coefficients over a wide temperature range and have extremely low losses for a variety of applications such as active safety antenna systems, radio backhaul communication systems, handheld mobile device and Wi-Fi antennas, power amplifiers, and in-vehicle information systems/infotainment systems.

The RO3200 Series are high-frequency circuit materials manufactured by Rogers Corporation that are specifically designed to meet the needs of high-performance electronics and RF applications. Below are some of the key features and benefits of RO3200 Series HF circuit boards:

Electrical Performance: 

The RO3200 series offers excellent electrical performance, including low dielectric constant (Dk) and low loss factor (Df), properties that are critical for high frequency applications.

Mechanical Stability: 

Reinforced with fiberglass cloth, this series provides enhanced mechanical stability and rigidity for ease of handling and processing.

Coefficient of Thermal Expansion: 

The coefficient of thermal expansion (CTE) of the RO3200 series is similar to that of copper, which makes them well suited for mixed-press designs with epoxy glass cloth FR4 multilayer board circuits.

Processing: 

RO3200 Series materials can be used to fabricate printed circuit boards using standard PTFE circuit board processing, which provides convenience for manufacturers.

Dimensional Stability: 

Due to its low coefficient of thermal expansion, the RO3200 series offers excellent dimensional stability over a wide temperature range.

Surface Characterization: 

The RO3200 series combines the surface flatness characteristics of non-glass cloth PTFE with the hardness characteristics of glass cloth PTFE laminates to achieve better linear etch tolerances.

Application Areas: 

These materials are suitable for a wide range of high-frequency applications, including automotive collision avoidance systems, satellite positioning antennas, wireless communication systems, microstrip antennas, direct broadcast satellites, power supply backplanes, fiber optic system data links, remote meter reading systems, broadband access and wireless broadband, and base station infrastructure.

Quality Certification: 

The production of RO3200 series laminates has passed the ISO quality certification system to ensure the consistency and reliability of the products.

Product Specifications: 

Different materials in the RO3200 series such as RO3203, RO3206 and RO3210 have different dielectric constants and loss factors to meet the specific requirements of different applications.

Technical Support: 

Rogers Corporation provides detailed technical documentation and datasheets to help engineers make informed decisions during the design and manufacturing process, as well as engineering support and sales services.

Wide Frequency Range: 

The electrical performance of the RO3200 Series is consistent over a wide frequency range, capable of supporting frequency applications beyond 40 GHz.

Fire Rating: 

The RO3200 series typically has a UL 94V-0 fire rating, a standard commonly used in electronic equipment.

Applications: The RO3200 series is suitable for a wide range of high frequency applications including automotive collision avoidance systems, satellite positioning antennas, wireless communication systems, microstrip antennas, live satellites, power backplanes, data links for fiber optic systems, remote meter reading systems, broadband access and wireless broadband, base station infrastructure, and more.

These characteristics make the RO3200 series of boards ideal for high-performance electronics and RF applications, where they combine excellent electrical performance and mechanical stability for a wide range of complex high-frequency circuit designs.