RO3003 PCB Laminate

RO3003™ laminates are high performance, high frequency circuit materials manufactured by Rogers Corporation, a ceramic-filled polytetrafluoroethylene (PTFE) composite material used primarily in printed circuit boards (PCBs) for commercial microwave and RF applications. Some key parameters of RO3003 laminates are described below:

Dielectric constant (Dk): 3.00 +/- 0.04

Dielectric constant is a measure of a material's ability to store electrical energy. RO3003 laminates have a stable dielectric constant, which helps to maintain the performance of circuits at different temperatures and frequencies.

Depletion Factor (Df): 0.0013 @ 10GHz

Loss factor is a measure of the energy dissipated by a material in an alternating current field, and the low loss factor of RO3003 laminates makes them ideal for high frequency applications.

Thickness: 

Typically offered in a standard thickness of 5 mil (0.005 inches, approximately 0.127mm), but other thickness options may be available.

Copper Foil:

Rolled Copper is available as an option, this refers to the type of copper foil, rolled copper has good electrical conductivity and mechanical properties.

Applications:

RO3003 laminates are suitable for a wide range of applications including, but not limited to, automotive radar, radio backhaul communication systems, handheld mobile devices and Wi-Fi antennas, power amplifiers, in-vehicle information systems/infotainment systems, and more.

Processing Technology:

The product can be processed using standard PTFE circuit board processing techniques, which means it can be processed into a variety of complex circuit board designs.

Stability:

RO3003 laminates have excellent dielectric constant stability despite varying temperatures and frequencies, which is essential to ensure circuit performance under varying environmental conditions.

Other Features:

RO3003G2™ is the next generation of RO3003™, optimized for 77/79 GHz automotive radar designs with lower insertion loss and further reduced Dk variation, supporting microvia designs.

Operating Frequency Range: 

Designed for high-frequency applications, RO3003 laminates typically meet the needs of microwave and RF applications.

Temperature Stability: 

The material maintains its electrical properties over a wide temperature range, which is important for electronic devices that need to operate at extreme temperatures.

Mechanical Properties: 

These include tensile strength, flexural strength, hardness, etc. These properties are critical to ensure that the board is physically able to withstand the various stresses and shocks that may be encountered during use.

Thermal Resistance: 

RO3003 laminates are able to withstand a certain level of high temperature, which is an important consideration for electronic devices that need to work in high temperature environments.

Chemical Resistance: 

The ability of the laminate to resist chemicals, which may be important in certain specific industrial applications.

Dimensional Stability: 

The dimensional stability of the laminate during the manufacturing process is critical to ensure the board's accuracy and repeatability.

Processability: 

This includes the processability of the laminate in terms of drilling, cutting, laminating, etc., which are important for manufacturing complex circuit board designs.

Environmental Requirements: 

Some applications may require materials to meet specific environmental standards or regulatory requirements.

Supply Chain and Availability: 

The supply chain stability and availability of materials is also an important consideration for production and design teams.

Cost Effectiveness: 

While meeting technical requirements, cost is also an important consideration, especially in mass production.