RO3003 High Frequency PCB

RO3003 high-frequency laminate material, which is based on a ceramic-filled polytetrafluoroethylene (PTFE) composite. This material is particularly suitable for printed circuit boards (PCBs) in commercial microwave and radio frequency (RF) applications. Below are some of the key properties and applications of RO3003:

Stable Dielectric Properties: 

RO3003 maintains dielectric constant (Dk) stability over a wide range of temperatures and frequencies.

Low Lloss: 

RO3003 laminates show very low dielectric loss (DF) of 0.0013 at 10 GHz.

Wide Temperature Range: 

Operating temperature varies from -50 degrees Celsius to +150 degrees Celsius.

Low Z-axis Coefficient of Thermal Expansion: 

Low Z-axis CTE (Coefficient of Thermal Expansion) contributes to the reliability of plated holes.

Wide Range of Applications: 

Suitable for a wide range of frequencies, including automotive millimeter wave radar boards (77 GHz), advanced assisted driving systems (ADAS), and 5G wireless infrastructure (millimeter wave) applications.

Material Specifications: 

Dk value of 3.00 +/- 0.04 and dielectric loss Df of 0.0010@10 GHz.

Cost-effective: 

RO3003 is considered cost-effective due to its low-loss characteristics and wide range of applications.

Processing Technology: 

RO3003G2 high frequency PCB material can be made into printed circuit boards using standard PTFE circuit board processing technology.

Optimized Design: 

RO3003G2 is an enhanced version of RO3003, specifically designed to meet the next-generation needs of millimeter-wave automotive radar applications with lower insertion loss and optimized resin filler content.

Sizes and Thicknesses: 

Options are available in standard sizes and different dielectric thicknesses to suit different application requirements.

Material Certification: 

RO3003 materials are ISO 9001 certified, which indicates that the manufacturing process and product quality meet international standards.

Environmental Stability: 

RO3003 provides excellent dielectric properties even in harsh thermal environments, making it ideal for use in demanding applications.

Design Flexibility: 

Due to its low rate of change of dielectric constant, RO3003 allows designers to achieve more accurate circuit designs in high frequency applications.

Specialty Packing: 

RO3003G2 utilizes advanced specialty packing with smaller particles, which helps achieve higher density and smaller diameter microvia designs.

Low Insertion Loss: 

RO3003G2 has an insertion loss of only 1.3dB/inch at 77GHz on a 5 mil thick material, which is important for high performance radar and communication systems.

Material Compatibility: 

The RO3003 material is compatible with standard PTFE circuit board processing techniques, making it easy to integrate into existing manufacturing processes.

Size Options: 

RO3003G2 is available in a variety of sizes and thicknesses, including 24 x 18 in. (610 x 457 mm) and 24 x 21 in. (610 x 533.75 mm), to accommodate different board design requirements.

Copper Cladding Options: 

RO3003G2 HF PTFE laminates are available with a choice of electrolytic and calendered copper cladding containing 0.5 oz. (18 µm) or 1.0 oz. (35 µm).

Areas of Application: 

In addition to the previously mentioned applications, RO3003 is also suitable for advanced driver assistance systems such as adaptive cruise control, forward collision warning, active brake assist, lane change assist, traffic jam navigation, self-parking and blind spot detection.

Technical Specifications: 

The RO3003's technical specifications include, but are not limited to, its Dk value, dielectric loss, and coefficient of thermal expansion, which are critical parameters for ensuring the board's performance in high frequency applications.

RO3003 is a popular choice for high frequency PCB design and manufacturing due to its excellent electrical performance and wide range of applications. It meets the needs of modern electronic equipment for high performance, high reliability and complex designs.