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Rogers PCB

PCB High Frequency Factory

Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm 

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


Shenzhen Xinchenger Electronics Co., Ltd. is a one-stop solution strength factory for high-reliability PCBs and PCBAs, with rich experience from single-sided to complex multi-layer printed circuit boards and top-level assemblies (PCBA).

We have a wide range of domestic and imported HF plates: Rogers, Taconic, Isola, F4B (Teflon), TP-2, FR4, etc. with dielectric constants ranging from 2.2-10.6. We can provide 24 hours fast sample service in time to win business opportunities for our customers. Meanwhile, our company has more than ten years of strong production experience, skillful craftsmanship, engineering technology and excellent service. We have the advantages of high quality, low cost and foreign information technology support.Long-term supply of high frequency PCB circuit boards, Rogers PCB high frequency, Taconic PCB high frequency, F4B/Teflon PCB high frequency, microwave RF boards, special circuit boards and so on. HF circuit boards, PCB high frequency boards, Suitable for data communication high frequency PCB.

What are The Materials Used to Make High Frequency PCB?

The performance of HF boards in wireless or other high frequency scenarios is dependent on the substrate material. For many applications, the use of multilayer FR4 materials improves dielectric performance. Commonly used boards when manufacturing HF PCBs include Rogers, ISOLA , Taconic, Panasonic, and TAYO boards.

High-frequency board parameter characteristics:

 a, The coefficient of thermal expansion of the HF PCB substrate and copper foil must be the same, if it is not the same, it will cause the copper foil to separate in the process of hot and cold changes.

 b, High frequency circuit board substrate water absorption should be low, high water absorption will cause the dielectric constant and dielectric loss in moisture.

 c, High frequency circuit board substrate dielectric constant (Dk) must be small and stable, generally speaking, the smaller the better, the signal transmission rate and the square root of the material dielectric constant is inversely proportional to the high dielectric constant is likely to cause signal transmission delays.

 d,  High frequency circuit board substrate material dielectric loss (Df) must be small, which mainly affects the quality of the signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

 e, High frequency circuit board substrate materials, heat resistance, chemical resistance, impact strength, peel strength must also be good. Currently more used high-frequency circuit board substrate is fluorine dielectric substrate, such as polytetrafluoroethylene (PTFE), usually known as Teflon, usually used in more than 5GHz. There are also FR-4 or PPO substrates, which can be used for products between 1GHz and 10GHz.

HF PCB are generally used in radar systems, satellites, antennas, cellular telecommunication systems-power amplifiers and antennas, live satellites, E-band point-to-point microwave links, Radio Frequency Identification (RFID) tags, airborne and terrestrial radar systems, millimeter-wave applications, missile guidance systems, space satellite transceivers, and other fields.

Process Capability Parameters

Sequence  Number ProjectParameters
1Materials Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2Maximum Layer sample 36L/Batch 28L
3Maximum Plate ThicknessSamples 8.0mm/Batch 6.0mm
4Thinnest Plate Thickness2L-0.1mm
5Maximum Panel Size1200 * 610mm
6Minimum Line Width Line Spacing0.075mm (3mil)
7Minimum Pad Spacing0.1mm (4mil)
8Completed Aperture0.15mm-6.3mm
9Hole Wall Copper Thickness> 25um (1mil)
10Appearance Tolerance ± 0.1mm (4mil)
11Impedance Tolerance± 10%
12PTH Aperture Tolerance± 0.075mm (3mil)
13NPTH Hole Tolerance± 0.05mm (2mil)
14Hole Position Deviation± 0.05mm (2mil)
15Minimum Blind Buried Hole0.1mm (4mil)
16Plate Bending and Warping ≤ 0.7%
17Outer Copper Thickness 1oz-5oz
18Lnner Layer Copper Thickness1/2oz-4oz
19Outer Copper Thickness 12:01
20SMT Minimum Green Oil Width0.08mm
21Minimum Green Oil Window Opening0.05mm
22Special ProcessThick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23Surface Treatment ProcessesInclude OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.


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