Rogers3210 High Frequency Board
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;
Processing Size : 600 * 1200mm ;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers.
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.
We mainly produce high-frequency circuit board, high-frequency microwave RF circuit board, Rogers Rogers 4350/4003/5880/3003/3006/3010/3210, etc.
Provide high frequency PCB/PCBA circuit board, Rogers high frequency board.
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We have a wide range of domestic and imported HF plates: Rogers, Taconic, Isola, F4B (Teflon), TP-2, FR4, etc. with dielectric constants ranging from 2.2-10.6. We can provide 24 hours fast sample service in time to win business opportunities for our customers. Meanwhile, our company has more than ten years of strong production experience, skillful craftsmanship, engineering technology and excellent service. We have the advantages of high quality, low cost and foreign information technology support.Long-term supply of high frequency PCB circuit boards, Rogers PCB high frequency, Taconic PCB high frequency, F4B/Teflon PCB high frequency, microwave RF boards, special circuit boards and so on. HF circuit boards, PCB high frequency boards, Suitable for data communication high frequency PCB.
Process Capability Parameters
Sequence | Number Project | Parameters |
1 | Materials | Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc |
2 | Maximum | Layer sample 36L/Batch 28L |
3 | Maximum Plate Thickness | Samples 8.0mm/Batch 6.0mm |
4 | Thinnest Plate Thickness | 2L-0.1mm |
4L-0.4mm | ||
6L-0.6mm | ||
8L-0.8m | ||
10L-1.0mmm | ||
5 | Maximum Panel Size | 1200 * 610mm |
6 | Minimum Line Width Line Spacing | 0.075mm (3mil) |
7 | Minimum Pad Spacing | 0.1mm (4mil) |
8 | Completed Aperture | 0.15mm-6.3mm |
9 | Hole Wall Copper Thickness | > 25um (1mil) |
10 | Appearance Tolerance | ± 0.1mm (4mil) |
11 | Impedance Tolerance | ± 10% |
12 | PTH Aperture Tolerance | ± 0.075mm (3mil) |
13 | NPTH Hole Tolerance | ± 0.05mm (2mil) |
14 | Hole Position Deviation | ± 0.05mm (2mil) |
15 | Minimum Blind Buried Hole | 0.1mm (4mil) |
16 | Plate Bending and Warping | ≤ 0.7% |
17 | Outer Copper Thickness | 1oz-5oz |
18 | Lnner Layer Copper Thickness | 1/2oz-4oz |
19 | Outer Copper Thickness | 12:01 |
20 | SMT Minimum Green Oil Width | 0.08mm |
21 | Minimum Green Oil Window Opening | 0.05mm |
22 | Special Process | Thick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc. |
23 | Surface Treatment Processes | Include OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc. |