Rogers 5880 Circuit Board PCB Factory
Line Width : 3MIL ;
Line Spacing : 4MIL ;
Drilling Diameter : =0.3mm ;
Processing Size : 600 * 900mm;
Plate Thickness : 3mm ;
Layers : 10 layers;
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.
RT/duroid® 5880 HF laminates are PTFE glass fiber reinforced. These microfibers are randomly distributed within the material to provide maximum strength enhancement for circuit application processes and circuit manufacturing processes.
These high-frequency materials have the lowest dielectric constant in their class, and their extremely low dielectric loss makes them ideally suited for high-frequency, wide-band applications where minimizing dispersion and loss is required. In addition, RT/duroid® 5880's extremely low moisture absorption makes it ideal for applications in high humidity environments.
RT/duroid 5880 can be easily cut into desired shapes and is resistant to all solutions and reagents used in the etching and plating of through holes. RT/duroid 5870 and 5880 laminates offer the lowest dielectric loss of any reinforced PTFE material, low moisture absorption, isotropy, and minimal variation in electrical properties with frequency.
In response to the increasingly stringent requirements of high-frequency circuit design, ROGERS has introduced a new generation of high-frequency laminates, RT/duroid® 5880, which is manufactured from PTFE glass fiber reinforced material with microfibers randomly distributed within the material, which greatly safeguards the strength of the laminate during the circuit application process and production. rt/duroid® 5880 RT/duroid® 5880 has the lowest dielectric constant compared to similar materials on the market today, with a dielectric constant of 2.20±0.02 at 10 GHz IPC-TM 220.127.116.11, and a dielectric loss of only 0.0009 at the same standard, making it ideally suited for high-frequency and wide-band applications that require minimized dispersion and loss. It supports frequencies up to the Ku-band and beyond. In addition, the RT/duroid® 5880 has an extremely low moisture absorption of 0.02%, making it ideal for applications in high humidity environments.
RT/duroid 5880 can be easily cut into desired shapes, perfectly adapting to the printed circuit board shapes required for various cavity configurations in high frequency applications. RT/duroid 5880 as a high frequency laminate can support electrodeposited copper thicknesses from 8 to 70 um, and the high frequency laminate is resistant to various acids and alkalis used in the process as well as a variety of high and low temperature processes. RT/duroid 5870 has the lowest dielectric loss of any reinforced PTFE material, a low moisture absorption, and isotropic, extremely low variation of electrical properties with frequency. The minimal change in electrical properties with frequency makes it ideal for use in commercial aviation telephone circuits, microstrip and stripline circuits, millimeter-wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas.
Key features of RT/duroid® 5880 laminates:
- Extremely low dielectric constant, 2.20 ± 0.02 measured at 10 GHz IPC-TM 18.104.22.168 standard;
- Extremely low dielectric loss, with a dielectric loss factor of 0.0009 measured at 10 GHz IPC-TM 22.214.171.124;
- Supports the highest applied signal frequencies up to Ku-band and beyond;
- Moisture absorption as low as 0.02%;
- Meets lead-free process standards.
Rogers RT/duroid 5880 HF laminates are used in.
Commercial aviation telephone circuits；
Microstrip and ribbon line circuits；
Millimeter wave applications；
Military radar systems；
Missile guidance systems；
Point-to-point digital radio antennas.