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Rogers PCB

6-layer Roger+FR4 High Frequency PCB


Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm

Inner Core Thickness: 0.1-4.0mm

Inner Layer Trace/Space: 2.5mil/3mil

Hole Wall Copper Thickness: 20-50um

INQUIRY

A hybrid multilayer PCB that combines high-performance high-frequency materials from Rogers with traditional FR4 materials. This design is intended to provide the electrical performance required for high-frequency applications while maintaining compatibility and processing convenience with traditional FR4 materials. Here are some key performance features of the 6-layer Roger+FR4 high-frequency PCB:

High Frequency Performance: 

Rogers materials have excellent high frequency performance, low dielectric constant, and low dielectric loss, which are critical for high-speed signal transmission and RF applications.

Mixed-pressure Structure: 

By combining Rogers high-frequency materials with FR4 materials, better electrical performance and mechanical stability can be achieved while reducing costs.

Excellent Dielectric Properties: 

Rogers materials have low dielectric constants (Dk) and dielectric loss factors (Df), which help reduce losses and delays in signal transmission.

High-precision Impedance Control: 

Hybrid-pressure PCBs can achieve high-precision characteristic impedance control, which is very important for ensuring signal integrity.

Heat Resistance: 

Rogers materials generally have a higher glass transition temperature (Tg), which helps improve the reliability of PCBs in high-temperature environments.

Processability: 

FR4 material has good processability and can utilize existing multi-layer PCB manufacturing processes when combined with Rogers material.

Adaptability: 

Hybrid PCB can adapt to various RF and microwave applications, including wireless communications, radar systems, satellite communications, etc.

Environmental Characteristics: 

Hybrid PCB can use environmentally friendly materials, which meets the requirements of modern electronic products on environmental impact.

Antioxidation: 

Some Rogers materials such as RO4835 have antioxidants added to improve the material's anti-oxidation performance.

Z-axis Thermal Expansion Coefficient: 

The Z-axis thermal expansion coefficient of high frequency materials is low, which helps to maintain the dimensional stability of the PCB at different temperatures.

Temperature Characteristics of Dielectric Constant: 

Although some Rogers materials may vary in the temperature characteristics of Dk, they are generally able to provide stable performance over a wide temperature range.

6-layer Roger+FR4 high frequency PCB combines the advantages of both materials to provide a high-performance solution for complex high-frequency applications with strict electrical performance requirements.

Interlayer Interconnection: 

Hybrid PCB can achieve effective interconnection between different layers to meet the needs of complex circuit design.

High frequency Signal Transmission: 

Hybrid PCB design can meet the requirements of high-speed and high-fidelity signal transmission, especially for microwave RF PCB applications.

Dielectric Property Stability: 

The dielectric properties (DK, DF) of the mixed-press PCB remain stable under environmental changes such as frequency, humidity and temperature.

Material Compatibility: 

The compatibility of Rogers RO4835 material with FR4 material allows the use of traditional processing technology and lead-free soldering process.

Dimensional Stability and Hardness: 

Some Rogers materials provide better dimensional stability and hardness, and have lower water absorption.

Wide Range of Applications: 

Suitable for global positioning satellite antennas, cellular telecommunications systems, power amplifiers and antennas, patch antennas for wireless communications, broadcast satellites, power base plates, automotive radars and many other applications.

Branded Raw Materials: 

Some manufacturers use Grade A military materials and raw materials from well-known brands to ensure the high quality of PCBs.

Imported Equipment: 

Use advanced production equipment such as fully automatic copper deposition, desmearing, graphic and electrical etching lines, LDI exposure machines, and text printing machines to support the rapid production of high-precision PCB samples and small and medium batches.

Service and Cooperation: 

Provide fast-response customer service, 24-hour online service, customer return visits in emergency situations, etc. to ensure customer satisfaction.

These performance characteristics make 6-layer Roger+FR4 high frequency PCB an ideal choice for high-frequency circuit design in high-performance electronic systems, especially in applications that require precise impedance control and signal integrity.

PCB-10

What are the production precautions?

When producing 6-layer Roger+FR4 high-frequency PCBs, the following precautions need to be considered to ensure product quality and performance:

Material Selection:

Make sure that the specified Rogers high-frequency materials and FR4 materials, as well as compatible prepregs (PP) and core boards are used.

Interlayer Positioning: 

During the lamination process, the interlayer positioning needs to be precisely controlled to ensure the correct connection and performance of the circuit.

Interlayer Stacking and Alignment: 

The interlayer stacking must be uniform and the alignment accuracy must be high to avoid short circuit or open circuit problems.

Precise Lamination Control: 

The temperature, pressure and time during the lamination process need to be precisely controlled to ensure interlayer bonding and electrical performance.

Impedance Control: 

The characteristic impedance needs to be precisely controlled to meet the requirements of high-frequency signal transmission.

Signal Integrity: 

Signal integrity needs to be considered during design to avoid signal reflection, attenuation and crosstalk.

Electromagnetic Compatibility: 

The design should consider electromagnetic compatibility to reduce the impact of electromagnetic interference on circuit performance.

Thermal Management: 

Thermal management should be considered during design to ensure the reliability of PCB in high temperature environment.

Browning Treatment: 

Before laminating multi-layer PCB, the internal circuit layer should be browned to enhance adhesion.

Inner Layer Quality Inspection: 

Before lamination, the inner layer should be quality inspected to ensure that there are no connections or other defects.

Symmetry: 

The structure of the multi-layer board should remain symmetrical to avoid warping due to thermal stress.

Material Compatibility: 

Ensure good compatibility between the selected materials, especially the combination of high-frequency materials and FR4 materials.

Special Process Requirements: 

According to specific product requirements, special processes may be required, such as plugging requirements, lead-free soldering processes, etc.

Quality Control: 

Strict quality control is required throughout the production process, including automatic optical inspection (AOI) and electrical performance testing.

Environmental Adaptability: 

Consider the performance of PCB under different environmental conditions, such as temperature, humidity, etc.

Design Files: 

The design files submitted to the PCB manufacturer need to be complete, including layer structure, substrate information, impedance control requirements, etc.

Communication with Manufacturers: 

Keep communicating with PCB manufacturers to ensure that they understand the design intent and can meet the manufacturing requirements.

Cost-effectiveness: 

While meeting performance requirements, consider cost-effectiveness and select appropriate materials and processes.


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