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Rogers PCB

5.8G RF High Frequency Board PCB

Thickness: 0.1-12mm

Coper Foil Thickness: 0.5oz-5oz

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm

Inner Core Thickness: 0.1-4.0mm

Inner Layer Trace/Space: 2.5mil/3mil


5.8G RF HF PCB (Printed Circuit Board) is a circuit board designed specifically for the 5.8GHz band and is typically used for RF applications such as wireless communications, radar, satellite communications, radio broadcasting, etc. 5.8GHz is a high-frequency band, and as such, there are special requirements for PCB materials and design to ensure signal integrity and performance. Here are some key features and considerations for 5.8G RF HF board PCBs:

High Frequency Materials: 

HF boards usually use special high frequency materials such as Rogers, TACONIC, ARLON, Isola, etc. These materials have low dielectric constant and low loss characteristics, which help to reduce losses during signal transmission.

Impedance Control: 

Impedance matching is particularly important at 5.8 GHz, and PCB design requires precise impedance control to minimise signal reflection and transmission losses.

Electromagnetic Compatibility (EMC): 

Electromagnetic interference (EMI) issues in RF applications need to be addressed through good design practices, including proper shielding and routing strategies.

Layout and Alignment: 

The layout and alignment design of 5.8G RF PCBs needs to optimise the signal transmission path and reduce crosstalk and radiation between signals.

High Speed Characteristics: 

Due to the high frequency characteristics of 5.8GHz, PCBs need to support high speed signal transmission, which may require the use of specific boards and design techniques.

Thermal Management: 

High-frequency operation may generate additional heat, so PCB design needs to consider heat dissipation, which may include the use of heat dissipation materials or the design of heat dissipation paths.

Manufacturing Accuracy: 

The manufacture of 5.8G RF HF board PCBs requires high precision equipment and techniques to ensure circuit accuracy and consistency.

Testing and Validation: 

Rigorous testing and validation of PCBs at 5.8GHz frequencies is a critical step in ensuring their performance and reliability.


While high frequency PCBs may require the use of special materials and manufacturing techniques, they also need to be designed with cost-effectiveness in mind in order to meet commercial requirements.

Customised Services:

Many PCB manufacturers offer customised services to design and manufacture 5.8G RF HF board PCBs to meet specific customer needs.


The function of 5.8G RF HF board PCB (Printed Circuit Board) mainly revolves around its use in RF (Radio Frequency) applications. Below are some of the main functions and application areas of 5.8G RF HF PCBs:

Wireless Communication: 

5.8G RF HF board PCBs are commonly used in wireless communication equipment, such as wireless routers, base stations, satellite communication equipment, etc., which provide high-speed data transmission in the 5.8GHz band.

Radar Systems: 

In radar systems, 5.8G RF boards are used to handle the transmission and reception of radar signals, including in applications such as automotive collision avoidance radar and weather radar.

Intelligent Transport Systems: 

5.8G RF boards can be used in intelligent transport systems, such as vehicle identification and electronic toll collection (ETC) systems, which rely on RF signals for communication and data exchange.

Internet of Things (IoT): 

With the development of IoT technology, 5.8G RF boards play a key role in connecting a variety of smart devices and sensors to support communication between devices.

Medical Devices: 

5.8G RF boards are used for wireless data transmission in certain medical devices, such as remote monitoring devices or wirelessly controlled medical instruments.

Radio Frequency Identification (RFID): 

5.8G RF boards are used in RFID systems for communication between readers and tags for inventory management, asset tracking, and more.

High Speed Data Transmission: 

Due to the large bandwidth offered by the 5.8GHz band, 5.8G RF boards can be used for high speed data transmission applications such as high speed local area networks (LAN).

Microwave Circuits: 

5.8G RF boards can be used to design and implement microwave circuits, including amplifiers, oscillators, filters, etc., which are very important in communications and signal processing.

Antenna Design: 

5.8G RF boards can be used to design and integrate antennas, including microstrip antennas, patch antennas, etc. These antennas are used to transmit and receive RF signals.

Test and Measurement: 

In RF test and measurement equipment, 5.8G RF boards are used for signal generation, modulation, demodulation and analysis.


When producing 5.8G RF high frequency board PCBs, there are some important considerations to be taken into account as follows:

Material Selection: 

Select high frequency boards suitable for 5.8GHz frequency, such as PTFE (polytetrafluoroethylene), ceramic filler materials, modified polyphenylene ether resin, etc. These materials have excellent electrical properties and good chemical stability.

Dielectric Constant and Dielectric Loss: 

Choose the substrate material with low dielectric constant and small dielectric loss angle tangent, because these parameters will affect the signal transmission quality.

Drilling Process: 

HF plates are brittle, and special attention needs to be paid to the selection of drill bits, drilling parameter settings, and the control of the number of stacked plate sheets to avoid plate fracture in the drilling process.

Hole Metallisation: 

The hole wall of the high frequency plate is not easy to copper, special hole treatment techniques need to be used, such as plasma treatment or sodium naphthalene activation treatment, in order to improve the metallisation quality of the hole wall.

Graphic Transfer: 

Precise control of line width and line spacing to ensure signal integrity and reduce transmission loss.

Etching Process: 

Control the etching process to reduce the creation of line nicks and sand holes, defects that can affect the performance of the circuit.

Soldermask Fabrication: 

Soldermask adhesion and blistering control of HF boards are difficult, requiring the use of appropriate pre-treatment methods and strict control of the curing process.

Surface Treatment: 

Select the appropriate surface treatment process according to the need, such as tin spraying, OSP (Organic Protective Film), ENIG (Electroless Nickel and Gold Plating), etc., and at the same time, strictly control the scratches and damages on the board surface.

Transmission Line Characteristics: 

Ensure that the characteristic impedance of the RF line is accurate, and generally require strict tolerances on the RF line, and need to ensure that the transmission line's hairy edges are neat and free of tiny burrs or gaps.

Shape Machining: 

Microwave printed circuit board substrate material processing accuracy than the FR4 requirements of the strict requirements of the shape of the tolerance needs to be controlled in a more stringent range.


Electrical performance testing of the circuit board, including impedance test, conduction test, insulation resistance test, etc., to ensure that the performance of the circuit board meets the requirements.

Quality Inspection: 

The appearance and dimensions of the circuit boards are carefully inspected to ensure that there are no defects and that they meet quality standards.

Forming and Cutting: 

According to the shape requirements of the final product, the circuit boards are cut and moulded accurately.

Packaging for Shipment: 

After completing all processes, the qualified circuit boards are properly packaged and ready for shipment.

Engineering CAM Data Processing: 

Follow the customer's design and pay attention to the fabrication tolerance requirements of the transmission line, and make appropriate process compensation according to the tolerance requirements and in combination with our factory's process capability.


For microwave dielectric materials, choose the appropriate cutting method, mostly milling and cutting, so as not to affect the flatness of the material and the quality of the board.

Resistance Welding: 

For PTFE material resistance welding is not allowed before grinding plate, if part of the substrate needs to print green oil, part of the substrate does not print green oil, you need to come out of the ‘bottoming film’, bottoming baking plate and then the second normal production.


High frequency microwave plate forming to CNC milling based on the use of high-frequency material milling cutter, and adjust the milling cutter speed parameters.

Tin Spraying: 

Pay attention to the temperature of the tin cylinder, the size of the wind pressure and the turnover, clamping process of the indentation and scratches.


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