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Rogers PCB

5.8G High Frequency PCB


Coper Foil Thickness:0.5oz-5oz

Max Panel Size:480*800mm

Drilling Diameter:≥0.1mm

Aperture Tolerance:±0.05mm

Hole Position Tolerance:±0.05mm

Inner Core Thickness:0.1-4.0mm

Inner Layer Trace/Space:2.5mil/3mil


5.8G high-frequency PCB refers to a high-frequency circuit board that works at a frequency of 5.8GHz, which is usually used in applications such as high-speed communication, radar, and wireless transmission. Here is some relevant information about 5.8G high-frequency PCB:

Application Scenarios: 

5.8G high frequency PCB can be applied to a variety of scenarios, such as smart home, smart doorbell, smart door lock, etc., especially suitable for scenarios such as night lights, solar street lights, and wireless cameras. These applications usually require high-frequency signal transmission to ensure high-speed transmission and processing of data.

Material Selection: 

In the design and manufacture of 5.8G high frequency PCB, the selection of materials is very critical. Commonly used high-frequency PCB materials include polytetrafluoroethylene (PTFE), Rogers (Rogers) sheet, etc. These materials have lower dielectric constants and losses, which help to improve signal transmission efficiency and reduce signal loss.

Design Considerations: 

When designing 5.8G high frequency PCB, factors such as signal integrity, impedance matching, and electromagnetic compatibility (EMC) need to be considered. In addition, the number of layers, wiring, and via design of the PCB need to be considered to ensure the effective transmission of high-frequency signals.

Manufacturing Process: 

The manufacturing process of 5.8G high frequency PCB includes drilling, electroplating, plugging, baking, grinding and other steps. In particular, the resin plugging process can solve the routing problem caused by the over-dense BGA parts, while avoiding short circuits and empty soldering caused by tin leakage.

Performance Test: 

The performance test of 5.8G high frequency PCB usually includes signal integrity test, impedance test, electromagnetic compatibility test, etc. to ensure that the performance of the PCB board meets the design requirements.


There are many suppliers in the market that provide customized services for 5.8G high frequency PCB, such as Shenzhen Migan Technology Co., Ltd., Suzhou Nanhang Circuit Technology Co., Ltd., etc. They provide one-stop services from design to production.

Product Specifications: 

5.8G high frequency PCB has various specifications and can be customized according to the specific needs of customers, including board thickness, number of layers, size, etc.

Technical Parameters: 

When choosing a 5.8G high frequency PCB, you need to pay attention to its technical parameters, such as dielectric constant, loss tangent, thermal expansion coefficient, etc. These parameters directly affect the performance of the PCB.


What are The Performances?

High frequency Performance: 

5.8G high frequency PCB is designed for high frequency applications at 5.8GHz, capable of handling high-speed data transmission, and suitable for wireless communication, radar systems, etc.

Signal Integrity: 

High frequency PCB needs to maintain signal integrity and reduce signal loss and distortion during transmission.

Impedance Control: 

Accurate impedance control is essential to ensure that signals are properly transmitted on PCBs, especially in high-frequency applications.

Electromagnetic Compatibility (EMC): 

5.8G high frequency PCB should have good electromagnetic compatibility, reduce electromagnetic interference (EMI) and improve signal anti-interference ability.

Thermal Performance:

High frequency PCB will generate heat when working, and good thermal performance will help dissipate heat and ensure the stable operation of PCB.

Mechanical Stability: 

High frequency PCB needs to have good mechanical stability to resist deformation caused by temperature changes, mechanical vibration, etc.

Material Properties: 

High frequency PCB usually uses special high frequency materials, such as PTFE, Rogers sheet, etc. These materials have low dielectric constant and low loss tangent, which helps to improve the transmission efficiency of high-frequency signals.

Dimensional Stability: 

During the manufacturing process, the dimensional stability of PCB is essential to maintain the accuracy and functionality of the design.


5.8G high frequency PCB needs to work stably under various environmental conditions and have high reliability.

Manufacturing Process: 

Including advanced processes such as fine line production, micro-hole processing, and resin plugging to meet the fine requirements of high-frequency applications.

Test Performance: 

5.8G high frequency PCB needs to pass a series of performance tests after production to ensure that it meets the design specifications and performance requirements.

Environmental Adaptability: 

5.8G high frequency PCB should be able to adapt to different working environments, including environmental factors such as temperature and humidity.

These performance indicators jointly determine the performance of 5.8G high-frequency PCB in actual applications, which is crucial to ensure the reliability and efficiency of high-speed communication and signal processing systems.


Production Precautions:

When producing 5.8G high frequency PCB, you need to pay attention to the following key matters to ensure product quality and performance:

Material Selection: 

Select PCB substrate materials suitable for high frequency applications, such as PTFE, Rogers board, etc. These materials have low dielectric constant and loss tangent.

Design Specifications: 

Follow high frequency circuit design specifications, including impedance control, signal integrity, electromagnetic compatibility (EMC) design, etc.

Fine Lines: 

High-frequency PCB requires very fine lines and spaces to reduce transmission loss and improve signal quality.

Impedance Matching: 

Ensure that the impedance of transmission lines such as microstrip lines and strip lines on the PCB matches that of connectors and chips to avoid signal reflection.

Blind/Buried Vias: 

For multi-layer high frequency PCBs, blind/buried vias are reasonably designed to achieve connections between different layers.

Resin Plugging: 

If resin plugging technology is used, it is necessary to ensure that there are no bubbles in the holes and the filling is uniform to avoid the problem of board explosion during subsequent welding.

Thermal Management: 

The heat dissipation of the PCB should be considered during design, and it may be necessary to use heat dissipation pads, copper foil, etc. to enhance heat dissipation.

Manufacturing Process: 

Use high-precision manufacturing processes such as laser direct imaging (LDI), high-precision drilling, electroplating, etc.

Quality Control: 

Implement strict quality control measures during the production process, including inspection of raw materials, semi-finished products and finished products.

Environmental Control: 

Maintain a stable production environment, such as temperature and humidity control, to reduce the impact of environmental factors on PCB quality.

Testing and Verification: 

After production is completed, conduct comprehensive performance tests, including impedance testing, signal integrity testing, EMC testing, etc., to ensure that the product meets the design specifications.

Batch Management: 

Strictly manage production batches to ensure traceability, facilitate quality control and problem tracking.

Operator Training: 

Ensure that operators are familiar with the production process and quality requirements of high-frequency PCBs and conduct regular training.

Equipment Maintenance: 

Regularly maintain and calibrate production equipment to ensure equipment accuracy and production efficiency.

Safety Regulations: 

Comply with relevant safety regulations and operating procedures to ensure the safety of the production process.


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