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Rogers PCB

4-layer Roger+FR4 PCB

Coper Foil Thickness: 0.5oz-5oz

Max Panel Size: 480*800mm

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm

Inner Core Thickness: 0.1-4.0mm


The 4-layer Roger+FR4 high-frequency board PCB combines the advantages of ROGER materials and FR4 materials and has the following performance characteristics:

High Frequency Performance: 

Roger material has excellent high frequency performance, low dielectric constant and low loss tangent value, and is suitable for high-frequency signal transmission above 500MHz.

Impedance Control: 

The dielectric constant of Roger material has low fluctuation with temperature, which can provide stable impedance control and is beneficial to the transmission of high-speed signals.

Thermal Management: 

FR4 material has good thermal stability and mechanical strength, which helps dissipate heat and improve PCB stability.

Mechanical Properties: 

Roger material has better mechanical properties than PTFE material, and can provide better bending resistance when combined with FR4.

Passive Intermodulation (PIM) Performance: 

Roger material's LoPro® copper foil can provide excellent passive intermodulation performance, which is very important for wireless communication applications.

CTE Matching: 

The coefficient of thermal expansion (CTE) of the Roger material matches that of copper, helping to reduce the stress on the PCB antenna.

Interlayer Connections: 

The 4-layer structure allows for more complex wiring designs while maintaining the reliability of interlayer connections.

Electromagnetic Compatibility (EMC): 

The excellent dielectric properties of Roger materials help improve electromagnetic compatibility and reduce signal interference.

Signal Integrity: 

The low-loss characteristics of Roger materials help improve signal integrity and reduce signal attenuation during transmission.


Although the cost of Roger materials is relatively high, using it in combination with FR4 materials can control costs while maintaining high-frequency performance.

Environmental Adaptability: 

Roger material has good environmental stability and is suitable for use under various environmental conditions.

Manufacturing Process: 

4-layer Roger+FR4 high frequency board PCB requires precise manufacturing processes, including lamination, drilling, pattern transfer, and etching.


The stability of Roger material and the mechanical strength of FR4 jointly ensure the long-term reliability of PCB.

Design Flexibility: 

The 4-layer structure provides design flexibility and can be customized according to different application requirements.

Suitable for High-performance Applications: 

This material combination is suitable for high-end applications such as high-performance computing, 5G communications, and automotive electronics.


The precautions for PCB processing of 4-layer Roger+FR4 high-frequency board are mainly reflected in the following aspects:

Material Properties: 

Roger materials generally have low dielectric constant and loss tangent values, making it well suited for high frequency applications. However, compared to FR4 materials, ROGER materials may require special processing techniques and equipment to maintain their high-frequency performance.

Lamination Process: 

4-layer PCB requires a precise lamination process to ensure tight bonding between layers and avoid delamination and blistering problems. For high-frequency material combinations such as ROGER+FR4, it is particularly important to control the temperature, pressure and time during the lamination process.

Drilling and Hole Wall Quality: 

High frequency boards have higher requirements for drilling accuracy and hole wall quality. When using laser drilling or mechanical drilling technology, it is necessary to ensure the accuracy of hole location and the smoothness of the hole wall, which is critical to signal integrity.

Pattern Transfer: 

Pattern transfer on high frequency materials requires high-precision equipment, such as LDI (laser direct imaging) technology, to ensure accurate transfer of circuit patterns.

Etching Process: 

When chemical or laser etching technology is used to remove the excess copper layer and form the required circuit pattern, the etching process needs to be precisely controlled to ensure high-frequency performance.

Surface Treatment: 

High frequency boards usually require special surface treatment, such as immersion gold, immersion tin or OSP (anti-oxidation) to improve welding performance and corrosion resistance.

Impedance Control: 

High frequency boards have strict requirements for impedance control. It is necessary to accurately calculate and control the dielectric constant, dielectric thickness, copper thickness and other factors of the board to ensure the integrity of signal transmission.

Thermal Management: 

High multilayer PCBs may generate more heat, especially in high-frequency applications. Therefore, proper thermal design and heat sinking need to be considered.

Signal Integrity: 

Due to the large number of signal lines and power planes present on a 4-layer PCB, signal integrity becomes even more important. Signal integrity needs to be improved through correct ground lead and ground plane planning, as well as reducing signal line length and noise interference.

Cost and Cycle: 

The manufacturing process of 4-layer Roger+FR4 high-frequency board is more complex than single-layer or double-layer PCB, which will increase production cost and cycle.

Anti-interference Problem: 

Multi-layer boards have more wiring area, which can increase the density and integrity of wiring, which is beneficial to improving the stability and anti-interference ability of the circuit. But for high-multilayer boards, how to maintain good anti-interference capabilities while increasing the number of layers is a challenge.

Stacking Control and Layer Alignment: 

When manufacturing a 4-layer PCB, it is very important to ensure the stacking sequence and layer alignment of each layer. This may involve using precise control methods and processes to avoid inter-layer offsets and errors. .

Due to these challenges, the processing of 4-layer Roger+FR4 high frequency boards usually requires professional PCB manufacturers who have the appropriate technology and experience to handle these complex manufacturing processes.

Suitable for High-performance Applications: 

This material combination is suitable for high-end applications such as high-performance computing, 5G communications, and automotive electronics.

Xinchenger Electronics Co., Ltd. has more than fifteen years of experience in PCB production and has complete PCB process equipment. It has Rogers high frequency sheets, RO3000, series, RO4000 series, RO5000 series, etc. all year round, with dielectric constants ranging from 2.2-10.6. If you have any needs for PCB high-frequency boards, RF PCB and other circuit boards, please come to us for customized drawings. Welcome to inquire!


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