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Rogers PCB

4-Layer F4B Silver Immersion PCB

Thickness: 0.1-12mm

Coper Foil Thickness: 0.5oz-5oz

Max Panel Size: 480*800mm

Drilling Diameter: ≥0.1mm

Aperture Tolerance: ±0.05mm

Hole Position Tolerance: ±0.05mm

Inner Core Thickness: 0.1-4.0mm


4-Layer F4B Sinking Silver PCB (Printed Circuit Board) is an electronic assembly with a multi-layer circuit design and a specific manufacturing process. Here are some of the functions and features of 4-layer F4B Sinking Silver PCBs:

Multi-layer Design: 

The four-layer design allows for more complex circuit layouts that can accommodate more electronic components and finer alignments.

Immersion Silver Process: 

Immersion silver is a surface treatment process that improves the conductivity and oxidation resistance of the PCB, extending the life of the PCB.

High Density Wiring: 

Multilayer design allows for denser wiring for high performance and miniaturised electronic devices.

Signal Integrity: 

Multilayer designs help reduce signal interference and improve signal integrity.

Thermal Management: 

Multi-layer PCBs allow for better heat distribution and help to improve the thermal efficiency of electronic devices.


4-layer F4B silver-immersed PCBs typically have higher reliability and stability due to the silver-immersion process and multi-layer design.

Cost Effectiveness: 

While multilayer PCBs may cost more to manufacture than single or double layer boards, the complexity and performance benefits they offer can lead to long-term cost savings.

Suitable for Complex Applications: 

For high-end electronics that require high-density integration, complex circuit designs and flexible layouts.

Easy to Maintain and Upgrade: 

Multilayer PCBs are designed to allow easier maintenance and upgrades as they can accommodate more components and alignments.

Electromagnetic Compatibility (EMC): 

Multi-layer PCB design helps to better control Electromagnetic Interference (EMI), and through proper layout and shielding techniques, the EMC of electronic products can be improved.

Power Management: 

Multi-layer designs can more effectively manage power distribution, reduce voltage drops and improve power efficiency.

High Frequency Applications: 

For applications that need to handle high-frequency signals, multilayer PCBs can provide better signal transmission performance and lower transmission delays.

Modular Design: 

Multilayer PCBs support modular design, allowing different parts of an electronic device to be developed and upgraded independently, improving design flexibility.

Miniaturisation and Lightweighting: 

As electronic devices move towards miniaturisation and lightweighting, multi-layer PCBs can achieve more functions in a limited space.

Environmental Adaptability: 

The immersed silver surface treatment provides better environmental adaptability, enabling the PCB to work stably under a wider range of temperature and humidity conditions.

Chemical Resistance: 

The immersed silver layer can resist the erosion of certain chemicals, improving the durability of PCBs in harsh environments.

Easy to Automate Production: 

The design and manufacturing process of multilayer PCBs is usually more standardised, facilitating automated production and improving productivity.


Multi-layer PCBs allow for better traceability during the manufacturing process, which helps with quality control and problem tracking.

Design Flexibility: 

Designers can take advantage of the flexibility of multilayer PCBs to optimise circuit design for better performance and lower cost.

For Applications with High Reliability Requirements: 

In areas where high reliability is required, such as military, aerospace and medical devices, multilayer PCBs can provide the stability and performance needed.

Support for Complex Signal Processing: 

For applications requiring complex signal processing, multilayer PCBs can support more signal layers and more complex signal routing.

Reduces System-level Costs: 

While multilayer PCBs may have a higher cost per board, they can reduce overall system lifecycle costs due to their high performance and reliability.


When producing 4-layer F4B silver immersion PCBs, there are a number of considerations that need to be taken into account to ensure product quality and production efficiency. The following are some important production considerations:

Process Flow Diagram: 

Ensure that the process flow diagram is clear and guides production.

Equipment and Role:

Use an automatic nickel-gold immersion production line.

Acid Degreasing: 

Remove copper surface grease and oxides.


removes copper surface oxides and increases plating adhesion.


Generate electroless nickel activator on copper lines.

Nickel and Gold Deposition: 

Deposits nickel and gold layers.


Prevents oxidation of nickel and gold layers.

Safety and Environmental Precautions:

Wear appropriate safety and labour protection equipment when operating.

Pay attention to the discharge of waste liquid and the disposal of waste gas when handling potion containing highly toxic substances.

Check whether the liquid level, temperature and circulating filter device of the medicine tank are normal.

Design Parameters:

Over-hole (VIA) design to meet the minimum size requirements.

Line design to meet the minimum line spacing and line width requirements.

PAD pad design to meet plug-in hole and pad size requirements.

Solder Protection and Character Design:

Insert hole openings and SMD openings to meet minimum size requirements.

Character design should ensure clear and readable.

Non-metallised slot holes: Slot holes are designed to meet minimum spacing requirements.


Collation design to meet gap and process edge requirements.

Original File Design:

Hole attributes should be selected correctly in PADS design.

Avoid locking the profile line or selecting the wrong option in the design software.

Profile Design: 

The profile design should be placed on the correct layer and special requirements such as internal grooves should be considered.

Metallised Slots and Holes: 

The special requirements of metallised slots and holes should be considered in the design.

Gold Finger Plate: 

When placing an order, it is necessary to note whether bevelled edge chamfering treatment is required.


Check whether the file has the phenomenon of less layer.

Prevention of Defects in Silver Immersion Process: 

Consider the influence of chemicals and equipment on defects and formulate preventive measures.

Preservation of Immersed Silver Plates: 

Use sulphur-free materials for packaging and store under suitable environmental conditions.

Chemical Silver Post-processing: 

Before moulding, sulfur-free paper needs to be padded between layers and top and bottom to prevent scratches.

4-layer F4B silver immersion PCB is usually used in high-end electronic products, such as smart phones, advanced medical devices, aerospace equipment and high-performance computing devices.

Our company has been focusing on HF PCB for many years, we have quite professional factory production hardware equipment experienced team, we can provide high performance, high difficulty HF PCB, F4B PCB, RF PCB, always equipped with Rogers, Taconic, F4B, CY and other high-performance boards. If you need, please feel free to enquire!


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