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PCB Thickness : 0.1mm-12mm;

Copper Thickness : 0.5oz-3oz;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


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RF PCBs (Radio Frequency Printed Circuit Boards) are significantly different from regular PCBs (Printed Circuit Boards) in several ways.

A. RF PCBs are very high-speed circuits that typically operate at frequencies of 100MHz and above, with a common range of 500MHz to 2GHz. This high-frequency characteristic makes RF PCBs a core component of high-tech devices such as wireless networks, smartphones, and smart TVs. In contrast, ordinary PCBs usually operate at lower frequencies and do not have the high-speed transmission capabilities of RF PCBs.

B. The design of RF PCBs is quite complex and must follow strict guidelines to mitigate interference problems caused by high-frequency signals. This involves signal integrity, impedance matching, electromagnetic shielding, and many other considerations. The design of ordinary PCBs, on the other hand, although it also needs to consider some electrical and mechanical properties, is much less complex compared to RF PCBs.

In addition, RF PCB has a wider range of uses in applications. In addition to the high-tech equipment mentioned above, it is also used in automotive, medical equipment, military and aerospace for precise measurement, detection and monitoring functions. Common PCBs, on the other hand, are more commonly used in various electronic devices as the basis for circuit connections and component installation.

In addition to the differences mentioned above, there are also differences between RF PCBs and ordinary PCBs in terms of material selection, manufacturing processes and testing requirements.

In terms of material selection, RF PCBs require the use of materials with excellent high-frequency performance, such as low-loss dielectric substrates and metal conductors with good electrical conductivity. These materials can reduce signal attenuation and interference, to ensure that high-frequency signal transmission quality and stability on the circuit board. While ordinary PCBs pay more attention to the electrical properties and mechanical strength of the material, the requirements for high-frequency performance is relatively low.

In terms of manufacturing process, RF PCB manufacturing process is more complex and delicate. Due to the transmission of high-frequency signals on the circuit board dimensional accuracy and wiring structure requirements are extremely high, so it is necessary to use high-precision processing equipment and processes, such as laser cutting, micro-hole drilling, etc.. The manufacturing process of ordinary PCBs, on the other hand, is relatively simple, and commonly used processes include etching, lamination and welding.

In terms of testing requirements, RF PCBs need to undergo more stringent testing and verification. Since the transmission characteristics of high-frequency signals are susceptible to various factors, such as electromagnetic interference, signal reflection, etc., RF PCBs are required to undergo comprehensive electrical performance testing and reliability assessment. These tests include impedance tests, transmission delay tests, signal integrity tests, etc. to ensure that the performance of the RF PCB meets the design requirements. The test of ordinary PCB is relatively simple, mainly focusing on the correctness of the electrical connection and the integrity of the function realization.

There are also significant differences between RF PCBs and ordinary PCBs in terms of material selection, manufacturing process and testing requirements. These differences make RF PCBs need to be more delicate and strict in the design and manufacturing process to meet the special requirements of high-frequency signal transmission. With the continuous development of wireless communication technology, RF PCBs will be more and more widely used in various fields, and the requirements for their performance and quality will also continue to improve.


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