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RF Circuit Board

PCB Thickness : 0.1mm-12mm;

Copper Thickness : 0.5oz-3oz;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.



The process flow of RF circuit boards mainly includes the following steps:

Material Preparation: Select the appropriate substrate materials and metallization materials, according to the circuit design requirements for its pretreatment, such as cleaning, removal of float plating, etc..

Preparation of The Substrate: Photolithography, etching and other processes on the substrate to form the pattern and structure of the circuit.

Depositing Metal: Depositing metal materials on the substrate by physical or chemical methods to form structures such as wires and gold fingers for circuit connection.

Drilling and Milling: According to the circuit design requirements, drilling and milling on the substrate to form connection holes, heat sinks and other structures.

Printed Circuit Board (PCB) Production: The pattern of the circuit is printed, hot air and other processes to form a printed circuit board, which provides support and protection for the circuit.

The required devices and components are fixed on the circuit board through soldering techniques, and connections and wiring are made.

Testing and Debugging: Test and debug the completed RF circuit board to ensure that the performance and reliability of the circuit meets the design requirements.


As for the RF circuit board manufacturing process needs to have the conditions, mainly includes the following points:

Suitable Equipment: 

Including photolithography, etching machines, deposition equipment, drilling machines, milling machines, printing machines, etc. These equipment need to meet the requirements of high precision and high stability to ensure the smooth progress of the processing and product quality.

High-quality Materials: 

The quality of the substrate materials and metallization materials directly affect the performance and reliability of the circuit board, so you need to choose high-quality raw materials, and strict testing and screening.

Skilled Technicians: 

RF circuit board manufacturing process involves a number of complex process steps, requiring specialized technicians to operate and monitor to ensure that each step of the process can meet the requirements.

Strict Quality Control System: 

The manufacturing process requires multiple inspections and tests to ensure the accuracy of each step of the process and the reliability of the product. Therefore, it is necessary to establish a perfect quality control system, including quality inspection, data analysis, problem tracing and other links.

Design and Simulation:

Before the process begins, circuit design is first required. This includes circuit schematic drawing, PCB layout and wiring design, and electromagnetic simulation. The design should fully consider the RF signal transmission characteristics, electromagnetic compatibility and thermal design of the circuit and other factors. Through simulation analysis, the performance of the circuit can be predicted, the design scheme can be optimized, and potential problems can be identified and solved in advance.

Environmental Control:

The RF circuit board process has strict environmental requirements. The process plant needs to maintain constant temperature and humidity, and to avoid contamination by dust and impurities. Some process steps also need to be carried out in a clean room to ensure the cleanliness and reliability of the board.

Process Parameter Optimization:

Individual process parameters in the manufacturing process have a significant impact on the performance of the board. For example, the exposure time of the photolithography machine, the etching depth of the etching machine, and the deposition rate of the deposition equipment all need to be precisely controlled. By continuously optimizing the process parameters, the processing accuracy and performance stability of the board can be improved.

Safety and Protection:

RF circuit board process materials and equipment used in the process may have a certain degree of danger, such as chemical solvents, high-temperature equipment. Therefore, the process needs to strictly comply with safety regulations, wear protective equipment to ensure the safety of operators.

Follow-up Processing and Packaging:

After the completion of the process, the circuit board also needs to be subsequent processing and packaging. This includes cleaning, drying, coating and other operations to improve the board's weathering and corrosion resistance. At the same time, it is also necessary to use the appropriate packaging methods to prevent damage during transportation and use.

RF circuit board manufacturing process is a complex and delicate process that requires comprehensive consideration of a number of factors. Only on the basis of meeting the above conditions can we produce high-quality RF circuit boards to meet the needs of various application scenarios.      


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