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RF Board Microwave PCB

PCB Thickness : 0.1mm-12mm;

Copper Thickness : 0.5oz-3oz;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


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Select suitable substrates to ensure that the dielectric constant, dielectric thickness and copper foil thickness of the substrate meet the design requirements.

Check the quality and reliability of raw materials to avoid using defective or non-compliant materials.

Process Control:

Strictly control the fabrication precision of the transmission line to ensure that the edges are neat and free of tiny burrs or notches to ensure the quality of signal transmission.

Pay attention to the uniformity of the plating thickness to avoid affecting the transmission quality of microwave signals.

Avoid the use of components with leads, and give priority to surface-mounted components in high-frequency environments.

Minimize the use of signal perforations to avoid lead inductance.

Environmental Requirements:

Ensure that the production workshop is clean and dust-free to avoid contamination of the board by dust and impurities.

Control the temperature and humidity in the workshop to maintain a stable production environment.

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Layout and Grounding Design:

Reasonable layout of the circuit to reduce signal interference and noise.

Provide abundant grounding layers and use molded holes to connect these layers to prevent the influence of 3D electromagnetic fields on the circuit boards.

Quality Inspection and Monitoring:

Strict quality inspection of the production process is carried out to ensure that each step of the process meets the specifications.

Production equipment is regularly maintained and calibrated to ensure accuracy and stability.

Safety and Health:

Pay attention to safety issues in the production process, such as protective measures when using chemicals.

Pay attention to the health condition of employees and ensure that the working environment meets the relevant standards.

Abnormal Handling and Prevention:

Handle abnormalities in the production process in a timely manner, such as the state of broken holes, analyze the causes and take preventive measures.

Periodically summarize and evaluate the production process, and continuously improve the production process and quality control methods.

RF microwave circuit board production process, in addition to the previously mentioned precautions, there are the following points need special attention:

Lamination and Layer Alignment:

Temperature and pressure should be strictly controlled during the lamination process to ensure tight bonding between layers and avoid delamination or blistering.

Inter-layer alignment is a critical step to ensure that the circuit functions correctly, and requires the use of high-precision alignment equipment and methods to ensure that the pattern between the layers is precisely aligned.

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Drilling and Metallization:

The drilling process should choose the appropriate drill bit and parameters to avoid burrs or cracks, affecting the electrical performance of the circuit board.

The metallization process should ensure that the hole wall plating is uniform and continuous to improve the conductivity and reliability of the circuit board.

Heat Treatment and Curing:

During production, some materials or process steps may require heat treatment or curing to improve their performance or stability. During this process, strict temperature and time control is required to avoid adverse effects on the board.

Cleaning and Protection:

Upon completion of production, the circuit board needs to be thoroughly cleaned to remove residues and stains generated during the manufacturing process.

At the same time, it is also necessary to carry out appropriate protective treatment of the circuit board, such as coating or encapsulation to improve its weather resistance and corrosion resistance.

Documentation and Traceability:

For the production process of RF microwave circuit boards, a perfect documentation system should be established to record the parameters and results of each step of the process.

This helps to trace and analyze problems as they arise, identify the root cause of the problem and take appropriate measures.

Continuous Technology Development and Innovation:

With the continuous development of science and technology, the production technology and process of RF microwave circuit boards are also advancing.

Enterprises should continue to pay attention to industry dynamics and technology trends, increase investment in research and development, and promote the innovation and optimization of the production process in order to improve product quality and performance.

Therefore, the RF microwave circuit board production process needs to pay attention to a number of aspects, from the selection of materials to process control, from environmental requirements to quality testing and so on need to be strictly controlled. Only by ensuring that each step of the process meets the specifications and requirements, can we produce high-quality, high-performance RF microwave circuit boards to meet the needs of a variety of application scenarios.


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