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PCB Printed Circuit Board

Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm 

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


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PCB printed circuit board in the production process is faced with a variety of difficulties, these difficulties relate to material selection, processing technology, environmental control and other aspects. The following are specific instructions:

Material Selection and Processing:

Many Types of Materials: PCB printed circuit boards require the use of a variety of materials, such as copper foil, insulating substrates, conductive materials, etc.. These materials in terms of performance, thickness, size and other differences, choose the right material and its effective treatment is a major difficulty in the production process.

High Material Performance Requirements: PCB needs to have excellent conductivity, insulation, heat resistance, corrosion resistance and other properties. In order to meet these requirements, the need to select high-quality materials, and strict material testing.

Processing Technology:

Drilling and Cutting Difficulty: Drilling and cutting are key steps in the PCB production process. Due to the PCB's many layers and high material hardness, the drilling and cutting process is prone to problems such as broken drill bits, inaccurate hole size, and poor cutting accuracy.

Plating and Etching: Plating and etching are important processes to form circuit patterns. Due to the differences in PCB surface materials and conductivity of different, electroplating process may be uneven electrolysis, excessive plating and other issues; etching process may also occur in the etching is not complete, graphic distortion and other issues.

Interlayer Alignment and Internal Circuit Production:

High Requirements for Interlayer Alignment: For multi-layer PCBs, interlayer alignment is the key. Due to the number of layers and complex structure, the interlayer alignment tolerance control is difficult and requires high-precision equipment and processes to ensure.

High Precision Requirements for Internal Circuit Production: The production of internal circuits involves the control of line width, line spacing, open circuit, short circuit and other parameters. Due to the small size of the PCB and high precision requirements, the production process is prone to low pass rate, signal interference and other problems.

Environmental Control:

Temperature and Humidity Control: PCB production process has high requirements for temperature and humidity. Too high or too low temperature and humidity may affect the performance of materials and processing quality.

Anti-static and Dust Control: Static electricity and dust are the two main enemies of PCB production. Static electricity may lead to component damage, and dust may contaminate the surface of the circuit board. Therefore, the production process needs to take anti-static and anti-dust measures.

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Testing and inspection:

High Test Equipment Requirements: PCB testing requires high-precision test equipment, such as automatic optical inspection instrument (AOI), X-ray detector. These equipments are expensive and complicated to operate, requiring specialized personnel for operation and maintenance.

Strict Inspection Standards: PCB quality inspection involves a number of aspects, such as appearance, size, performance and so on. Strict inspection standards, the treatment of substandard products also need to strictly comply with the relevant provisions.

Process Parameter Adjustment and Optimization:

PCB production involves multiple process steps, each step of the process parameters need to be precisely controlled. This includes plating time, etching depth, soldering temperature and so on. The adjustment and optimization of process parameters is a complex process that requires comprehensive consideration of material properties, equipment performance, production environment and other factors.

With the continuous updating of product design, PCB structure and performance requirements are constantly changing. Therefore, the adjustment and optimization of process parameters need to be carried out continuously to adapt to changes in market demand.

Quality Traceability and Problem Troubleshooting:

Due to the complexity of the PCB production process, when quality problems occur, tracing the source of the problem and troubleshooting the cause is often a difficult task. It is necessary to establish a perfect quality traceability system to record the data and information of each production process, so that problems can be quickly located and resolved.

The problem identification process may involve multiple departments and multiple areas of expertise, requiring coordination of resources from all parties to solve the problem.

Production Cost Control:

PCB printed circuit board production costs include material costs, equipment depreciation, labor costs and other aspects. In the production process, how to reduce production costs under the premise of ensuring product quality is an important issue that companies need to face.

Reduce production costs need to consider the choice of materials, process optimization, equipment maintenance and other aspects, the need for enterprises to continue to explore and sum up experience in the production process.

Regulations and Environmental Requirements:

With the increasing awareness of environmental protection, countries are imposing higher environmental requirements on electronic products and their production processes. PCB production involves a wide range of chemicals and emissions, and requires compliance with relevant regulations and standards to ensure that the production process is environmentally compliant.

Continuous updating of regulations and increased environmental requirements may require companies to invest more money and effort to improve production processes and equipment to meet the new requirements.

Supply Chain Management and Synergy:

PCB production involves multiple suppliers and partners, including material suppliers, equipment suppliers, and outsourced processors. Effective supply chain management and synergy are critical to ensure smooth production processes and product quality.

Enterprises need to establish long-term and stable relationships with suppliers, strengthen communication and collaboration to ensure the stability and reliability of the supply chain. At the same time, it is also necessary to conduct regular assessment and audit of suppliers to ensure that they meet the quality requirements of enterprises and environmental standards.

Therefore, PCB printed circuit boards are faced with various challenges and difficulties in the production process. Enterprises need to continuously strengthen technology research and development, optimize the process, improve staff quality, strengthen supply chain management and other aspects of the work, in order to adapt to the continuous changes in market demand and improve competitiveness. At the same time, it is also necessary to pay attention to the requirements of environmental regulations, and actively promote green production and sustainable development.


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