PCB platemaking includes the following:
Cutting: Cut the PCB Platemaking to production size.
Pre-treatment: Clean the surface of PCB Platemaking and remove surface contaminants.
Lamination: Apply the dry film to the surface of the PCB Platemaking to prepare for the subsequent image transfer.
Exposure: Use exposure equipment to expose the laminated substrate with UV light to transfer the image of the substrate to the dry film.
DE: After the exposure of the substrate will be developed, etched, removed from the film, and then complete the production of the inner layer of the board.
Browning: Browning increases the adhesion between the board and the resin, as well as increasing the wettability of the copper surface.
Riveting: Pressing multiple inner layers into a single board.
Drilling: Drilling holes in multilayer PCBs for operations such as soldering electronic components.
Pre-treatment of Circuit Boards: The toner on the board is sanded off with fine sandpaper, and then the board is cleaned with water. Wait for the circuit board on the water after drying, with rosin coated with lines on the side, you can use a hot air blower to heat the circuit board to accelerate the solidification of rosin, only 2-3 minutes rosin can be solidified.
Welding Electronic Components: All electronic components are welded to the circuit board, energized.
The above steps for the basic production process, different structures of the board its process is not the same, the above process for the complete production of multi-layer PCB process.
Characteristics of the PCB Platemaking Process
In the PCB platemaking process, the following points need to be noted:
Long Production Cycle: PCB Platemaking process is long, including pre-treatment, pressure film, exposure, development, etching, de-filming, browning, riveting, drilling, circuit board pre-processing, welding of electronic components and other steps, which takes a long time.
High Degree of Automation: Modern PCB manufacturing process is highly automated, most of the steps are completed by automated equipment, can greatly improve production efficiency and product quality.
High Precision Requirements: PCB board precision requirements are very high, especially in the production process of multi-layer PCB boards, the need to ensure the accuracy and consistency of the various layers of the line to ensure that the circuit board’s electrical performance and stability.
High Environmental Requirements: PCB manufacturing process will produce some waste and pollutants, the need to take effective environmental measures to deal with, in line with national environmental regulations.
Higher Costs: PCB manufacturing process is complex, requires the use of a large number of equipment and materials, so the manufacturing cost is higher.
PCB Platemaking process is characterized by long production cycle, high degree of automation, high precision requirements, high environmental requirements and higher costs.
PCB Platemaking Process Considerations
In the PCB platemaking process, the following points need to pay attention:
Board Selection: Should be based on circuit requirements and environmental conditions to choose the appropriate PCB board, such as FR4, CEM-1, copper substrate, aluminum substrate, etc…
Board Thickness Control: The thickness of the PCB board should meet the design requirements, uneven board thickness will affect the flatness and mechanical strength of the board.
Surface Treatment: The surface of the PCB board needs to be coated, sprayed with tin and other treatments to increase conductivity and corrosion resistance.
Splicing Design: For multi-panel design, you need to rationalize the splicing between the layers to ensure the overall performance and reliability of the circuit board.
Positioning Hole Design: Reasonable design of the location and size of the positioning holes in the PCB board to ensure the precise positioning and installation of the circuit board.
Component Layout and Wiring: The layout and wiring of components on the PCB board should be in line with the design rules and requirements, to avoid problems such as cross and parallel wiring, in order to reduce electromagnetic interference and signal interference with each other.
Thermal Design: For circuit boards with a large number of heat-generating components, it is necessary to reasonably design the heat dissipation method, such as adding heat sinks, fans, etc., to ensure the stability and reliability of the circuit board.
Anti-static Design: Add anti-static components and measures on the PCB board to protect the board from static interference and damage.
Voltage Testing: For high-voltage circuit boards, voltage testing is required to ensure that the board’s insulation performance meets the requirements.
Production Process Control: In the production process, strict control of the PCB board process parameters, such as drilling, copper plating, etching, gold immersion and other aspects of the quality and precision to ensure that the board’s manufacturing quality and reliability.
PCB manufacturing process requires attention to many issues, the need for board manufacturers with advanced equipment and technical strength and strict quality management system to ensure that the production of circuit boards to meet customer requirements. At the same time, the design stage needs to take into account the performance and reliability requirements of the circuit, rational arrangement of component layout and wiring and other elements.
