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PCB Packaging

PCB Packaging Process

PCB packaging includes the following:

Cleaning Treatment: The PCB is cleaned to ensure that there is no residual dirt or chemicals on the surface. Cleaning can be done by mechanical cleaning, ultrasonic cleaning, etc. to ensure the cleanliness of the PCB surface.

Electrical Performance Test: Before packaging, the PCB needs to be tested for electrical performance. This is to ensure that the PCB's circuit connection is normal, there is no short circuit, broken circuit and other problems. Commonly used test methods include contact test and non-contact test.

Packaging Material Preparation: Before packaging, you need to prepare the appropriate packaging materials. Packaging materials usually include boxes, anti-static bags, foam pads and so on. The selection of packaging materials should take into account the size, weight and protection requirements of the PCB.

Copper Sinking: After drilling the circuit board in the copper sinking cylinder will occur redox reaction, the formation of a copper layer on the hole hole metallization, so that the original insulating substrate surface deposition of copper, to achieve interlayer electrical communication.

Pressure Film: Pressure film after the PCB board above the pressure of a layer of blue dry film, dry film is a carrier, in the circuit process is very important.

Exposure: The negative and pressed dry film on the substrate alignment, the use of ultraviolet light in the exposure machine, the negative graphic transfer to the light-sensitive dry film.

Developing: The use of weak alkaline developer solution to the dry film has not been exposed or wet film dissolved rinse off, retaining the part that has been exposed.

Copper: The PCB board will be put into the copper equipment, copper part of the copper was electrically copper, the part blocked by the dry film is not reactive.

Desmear: The exposed dry film that protects the copper surface is stripped off with sodium hydroxide solution to expose the line graphics.

Etching: Has not been exposed to the dry film or wet film by the developer to remove the copper surface will be exposed, with acidic copper chloride will be part of the exposed copper surface dissolved corrosion off, to get the desired line.

Retreat: Retreat is to use the tin water to retire the tin on the line, so that the line back to the original color of copper.

PCB Packaging

Characteristics of The PCB Packaging Process

The PCB packaging process includes the following features:

Moisture: Because PCB is very easy to absorb moisture, affecting the reliability of the board, so you need to use colorless air beads plastic bags for vacuum packaging, the inner packaging into the desiccant and humidity card, to prevent the board from absorbing moisture.

Antioxidant: PCB circuit board surface spray tin, immersion gold and pad parts are oxidized will affect the welding, so the packaging needs to prevent oxidation.

Sealing: The bag should ensure that the package is tightly packed to avoid PCB circuit boards from contacting with humid air.

Marking: The label inside the package indicates "production time" and "expiration date" to prevent the board from being stored overdue.

Classification: PCBs are classified and labeled.

Storage Environment: The temperature of the warehouse where PCB circuit boards are stored should be controlled at 23±3℃, 55±10%RH, and the boxes should be stored in a dry and airy place while avoiding direct sunlight.

These features are to ensure the reliability and safety of PCB circuit boards.

PCB Packaging-2

PCB Packaging Process Considerations

In the PCB packaging process, the following points need to be noted:

Package Selection: It is very important to choose the right package, different components need to choose different package types and sizes. It should be selected according to the size of the component, power, number of pins, operating environment and other factors.

Pin Spacing: In PCB design, attention should be paid to the component pin spacing, so that it meets the standard specifications to avoid short circuits or poor contact between components.

Pin Location: In PCB design, should pay attention to the location of the component pins, to ensure that they are sufficiently spaced from other components on the PCB board to avoid mutual interference.

Heat Treatment: In PCB design, should pay attention to the heat dissipation of high-power components, the design of suitable heat dissipation equipment or heat dissipation program to ensure that the components will not be damaged due to overheating.

PCB Board Thickness: In PCB design, the thickness of the PCB board should be considered, choose the right thickness to meet the needs of component installation, and ensure that the PCB board is strong enough.

Package Marking: In PCB design, you should consider adding package marking for components for later maintenance and replacement.

Packaging Quality: In the selection of packaging manufacturers, you should choose a reliable manufacturer to ensure that the quality of packaging components in line with standard specifications, and can meet the circuit design requirements.

Packaging Specifications: PCB  boards should be packaged in accordance with the specifications to avoid misuse or bad habits and other situations. At the same time, attention should be paid to the observation of the packaging effect, timely detection of problems and processing.

Moisture and Dust: In the packaging process, measures should be taken to keep the PCB moisture and dust, to avoid damage by environmental factors.

Clear Marking: In the packaging process, the PCB board model, specification, lot number and other information should be clearly marked for subsequent traceability and management.

Safety Warning: In the packaging process, the safety warning signs on the PCB board should be correctly understood and handled to avoid safety accidents caused by misuse.

Environmental Requirements:  In the packaging process, should follow the environmental requirements, choose environmentally friendly materials and ways to package, reduce the impact on the environment.

PCB Packaging-1

PCB Transportatio Process Considerations

In the PCB transportatio process, the following points need to be noted:

Packaging Methods: PCB boards should be protected using appropriate packaging methods to avoid damage during transportation. Commonly used packaging methods include anti-static packaging, Styrofoam packaging, carton packaging and so on. The appropriate packaging method should be selected according to the material, size, weight and other factors of the PCB board.

Clear Marking: During transportation, the model, specification, quantity and other information of PCB boards should be clearly marked for subsequent tracing and management.

Moisture and Dust-proof: During transportation, measures should be taken to keep the PCB boards moisture and dust-proof to avoid damage by environmental factors.

Prevent Bending and Twisting: PCB boards should be kept flat and should not be bent or twisted to avoid damage to the board.

Prevent Static Electricity: In the transportation process, anti-static measures should be taken to avoid damage to the PCB board caused by static electricity. For example, anti-static bags or anti-static foam and other materials can be used for packaging.

Prevent Collision and Vibration: In the transportation process, the PCB board should be avoided by collision and vibration, in order to avoid damage to the circuit board. Cushioning materials can be used for packaging to reduce the impact of collision and vibration.

Temperature Control: During transportation, care should be taken to control the temperature of the PCB board to avoid damage to the board caused by excessive temperature.

Prevention of Pollution: During transportation, PCB boards should be avoided to be polluted, such as dust, oil, and so on. Materials such as protective cover or dust bag can be used for packaging to reduce the impact of pollution.

Safety Warning: In the transportation process, the safety warning signs on the PCB board should be understood and handled correctly to avoid safety accidents caused by misuse.

Environmental Requirements: In the transportation process, should follow the environmental requirements, choose environmentally friendly materials and ways to package to reduce the impact on the environment.

In short, in the PCB transportation process need to pay attention to a variety of issues, including packaging methods, clear marking, moisture and dust, prevent bending and twisting, prevent static electricity, prevent collision and vibration, temperature control, prevent pollution, safety warnings and environmental requirements. Only by paying attention to these details and take appropriate measures to protect, in order to ensure that the PCB board in the transportation process is not damaged, to ensure the quality and reliability of the product.

PCB transportatio

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