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The Difference Between Rogers 5880 and 5880LZ

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Rogers Corporation is a well-known manufacturer of electronic materials. Its RT/duroid® series of high-frequency laminates are widely used in high-performance electronic circuits. According to the search results provided, we can compare the characteristics and differences of RT/duroid® 5880 and 5880LZ materials:

RT/duroid® 5880

Dielectric constant (Dk): 2.20 ± 0.02 (at 10GHz);

Dielectric loss factor (Df): 0.0009 (at 10GHz);

Moisture absorption rate: Low, the specific value is not clear in the search results;

Coefficient of thermal expansion: Not specified in search results;

Density: Not specified in search results.

Features:

Low dielectric constant and low dielectric loss, suitable for high-frequency and wide-band applications.

Low moisture absorption rate, suitable for high humidity environments.

Easy to cut, drill and shape.

Good chemical resistance, suitable for etching and plating processes.

RT/duroid® 5880LZ

Dielectric constant (Dk): 2.00 ± 0.04 (at 10GHz)

Dielectric loss factor (Df): 0.0021 to 0.0027 (at 10GHz)

Moisture absorption rate: 0.31% (under 24 hours/23°C conditions)

Coefficient of thermal expansion: 40 ppm/°C (range 0 to 150°C)

Density: 1.4 gm/cm³

Features:

The lowest dielectric constant, suitable for applications that require extremely high signal transmission performance.

Low density and low Z-axis thermal expansion coefficient for weight-sensitive applications.

Uniform electrical characteristics covering a wide frequency range.

Resistant to all solvents and reagents, suitable for etching and plating processes.

罗杰斯 PCB

Main Difference

Dielectric Constant: 5880LZ has a lower dielectric constant of 2.00 ± 0.04, while 5880 has a slightly higher dielectric constant of 2.20 ± 0.02. A lower dielectric constant usually means better signal transmission performance.

Dielectric loss factor: The 5880 has a lower dielectric loss factor of 0.0009, which indicates less signal loss in high-frequency applications.

Moisture absorption rate: The moisture absorption rate of 5880LZ is 0.31%, while the moisture absorption rate of 5880 is not specified in the search results, but generally low moisture absorption rate contributes to the performance stability of the material in high humidity environments.

Coefficient of thermal expansion: 5880LZ has a decidedly low coefficient of thermal expansion, which may make it more stable in environments with large temperature changes.

Density: Both materials have a density of 1.4 gm/cm³, indicating that they may be similar in terms of weight and mechanical properties.

RT/duroid® 5880LZ

Low density and low Z-axis thermal expansion coefficient: This makes the 5880LZ suitable for applications with extremely high weight and thermal stability requirements, such as high-performance circuits in the aviation and aerospace fields.

Uniform electrical characteristics: Consistent over a wide frequency range, which is critical to ensuring consistent and reliable circuit performance.

Chemical Resistance: Resistant to solvents and reagents commonly used when etching printed circuits or plating edges and holes.

RT/duroid® 5880

Low moisture absorption: Although specific moisture absorption values are not provided in the search results, low moisture absorption is generally beneficial to maintain performance stability of materials under changing environmental conditions.

Processability: RT/duroid® 5880 material is easy to cut, drill and shape, making it suitable for manufacturing complex circuit board designs.

Chemical Resistance: Likewise, 5880 also exhibits good chemical resistance and is suitable for chemical treatments used in various circuit board manufacturing processes.

Differences in application areas

RT/duroid® 5880LZ is typically used in applications with stringent electrical performance requirements, such as:

Aeronautical antenna system;

Lightweight feed network;

military radar system;

missile guidance system;

Point-to-point digital radio antenna.

The RT/duroid® 5880 may be more focused on applications requiring low dielectric loss and high frequency performance, although the specific application areas are not detailed in the search results.

Both materials have excellent electrical and processing properties, making them suitable for the manufacture of high-performance circuit boards. Which material to choose needs to be decided based on specific design requirements, operating frequency, environmental conditions and specific needs for material properties. For example, if the application has extremely high requirements on dielectric constant and dielectric loss, RT/duroid® 5880 may be preferred. If the application requires lighter weight and better thermal stability, RT/duroid® 5880LZ may be a more suitable choice.

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