All Categories
News

Are There any Differences in Parameters and Performance Between Rogers 4003 and 4350B?

Hits : 7

Rogers' RO4003C and RO4350B are both high-frequency circuit boards. They each have some unique parameters and performance characteristics and are suitable for different application scenarios. Here are some key parameters and performance differences between the two materials:

RO4003C parameters and performance features:

Dielectric constant (Dk): 3.38 +/- 0.05;

Dissipation Factor (Df): 0.0027 @ 10 GHz;

Z-axis thermal expansion coefficient: 46 ppm/°C;

Processing technology: similar to FR-4, lower cost;

Design: Targeted at performance-sensitive, high-volume applications;

Electrical characteristic stability: stable electrical characteristics at different frequencies;

Flame retardant grade: non-brominated, does not meet UL 94V-0 flame retardant grade standard;

RO4350B parameters and performance features:

Dielectric Constant (Dk): 3.48 +/- 0.05;

Dissipation Factor (Df): 0.0037 @ 10 GHz;

Z-axis thermal expansion coefficient: 32 ppm/°C;

Processing technology: similar to FR-4, easy for mass production;

Price competitiveness: lower price than traditional microwave material laminates;

Flame retardant grade: Meets UL 94V-0 flame retardant grade requirements.

PCB-92

Performance Difference:

Dielectric Constant:RO4003C has a slightly lower dielectric constant than RO4350B, which may make it more suitable for applications with more stringent requirements on dielectric properties.

Loss Factor:The loss factor of RO4003C is lower than that of RO4350B, indicating that at 10 GHz frequency, RO4003C has lower signal loss.

Thermal Expansion Coefficient:The Z-axis thermal expansion coefficient of RO4003C is higher than that of RO4350B, which may affect the dimensional stability of the material under temperature changes.

Flame Retardant Rating:RO4350B meets the UL 94V-0 flame retardant rating, while RO4003C does not, making RO4350B more suitable for applications requiring flame retardant properties.

Cost:RO4350B has a cost advantage as it is less expensive than traditional microwave material laminates.

RO4003C Plate:

Dielectric constant (Dk): 3.38+/-0.05;

Dissipation Factor (Df): 0.0027 @ 10GHz;

Z-axis thermal expansion coefficient (CTE)**: 46 ppm/℃;

Glass transition temperature (Tg): >280℃;

Processing Technology:Similar to FR-4, no special pre-treatment is required;

Thickness Selection:Provides a variety of thickness options, such as 8mil, 12mil, 16mil, 20mil, 32mil, 60mil, etc.;

Features:Excellent dimensional stability, low dielectric constant tolerance, suitable for high-capacity applications.

PCB-96

RO4350B Plate:

Dielectric constant (Dk):3.48+/-0.05;

Dissipation Factor (Df): 0.0037 @ 10GHz;

Z-axis thermal expansion coefficient (CTE): 32 ppm/℃;

Processing Technology:Similar to FR-4, easy for mass production;

Thickness Selection:Provides a variety of thickness options, such as 4mil, 6.6mil, 10mil, 13.3mil, 16.6mil, 20mil, 30mil, 60mil, etc.;

Features:Low RF loss, low dielectric constant, excellent dimensional stability, compatible with traditional PCB manufacturing technology.

Performance differences and application considerations:

Dielectric Constant:The Dk value of RO4003C is slightly lower than that of RO4350B. For applications requiring a lower dielectric constant, RO4003C may be a more suitable choice.

Loss Factor:The Df value of RO4003C is lower, indicating that its signal loss in high-frequency applications is smaller, and it is suitable for occasions with higher signal integrity requirements.

Coefficient of Thermal Expansion:RO4350B has a lower CTE and may be more suitable for use in environments with large temperature changes to maintain the dimensional stability of the circuit board.

Flame Retardant Grade:RO4350B meets the UL 94V-0 flame retardant grade and is suitable for applications that have special requirements for flame retardant performance.

Cost-Effectiveness:RO4350B may be more cost-effective, especially in large-scale production.

Leave a Message

Hot categories