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Multilayer PCB

Multilayer PCB

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Multi Layer PCB Board Fabrication


Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm 

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

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Multi-layer PCB (Multi Layer PCB) board manufacturing process is relatively complex, involving a number of key steps and considerations. The following is the basic process of multi-layer PCB board manufacturing and the key issues that need attention:

Multi Layer PCB Board Manufacturing Process:

Inner Layer Line Production:

Pattern Transfer: Using photographic ink and exposure technology, the circuit pattern is transferred to the copper foil.

Etching: chemical reaction to remove the copper layer that is not protected by the ink to form the circuit.

Fading: Removal of the photographic ink.

Inspection and Correction:  Checking the quality of the circuit and correcting errors.

Lamination:

Laminating the pre-treated inner circuit board with a semi-cured sheet (Prepreg).

Lamination is performed under high temperature and pressure to make the layers tightly bonded.

Drilling:

Using a laser or mechanical drilling machine, the desired through and blind holes are drilled into the laminated board.

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The Holes are Metallized:

Chemical Copper Deposition: Deposits a thin layer of copper on the hole wall in preparation for subsequent circuit connections.

Hole Wall Plating: Thickening of the copper layer on the hole wall to ensure electrical conductivity.

Outer Layer Circuit Fabrication:

Similar to inner layer circuit fabrication, including steps such as graphic transfer, etching, and fading.

Soldermask and Character Printing:

Soldermask Printing: Protects the circuit from the external environment.

Character Printing: Marks component locations and board information.

Surface Treatment:

Electroplating (e.g. gold plating, tin plating, etc.) or chemical treatment as required.

Form Processing and Inspection:

Cut to desired form factor.

Perform electrical testing and appearance inspection to ensure quality.

Packaging & Shipping:

Packaging after qualification, ready for shipment.

Key Points to Note:

Material Selection and Matching:

Select suitable base material, semi-cured sheet and copper foil to ensure the performance and reliability of the sheet.

Materials between different layers should be matched to avoid problems after lamination.

Drilling Accuracy:

Drilling accuracy directly affects the connection performance and signal transmission quality of the board.

Parameters such as drilling position, hole diameter and hole depth need to be controlled to ensure accuracy.

Hole Metallization Quality:

The copper layer on the hole wall should be uniform, continuous and free of defects.

Chemical copper immersion and plating process, to control the solution concentration, temperature and time and other parameters.

Precision of Line Production:

Precision should be ensured during the graphic transfer process to avoid line offset or breakage.

Etching depth should be properly controlled to avoid over-etching or under-etching.

Lamination Quality:

The lamination process should control the temperature, pressure and time to ensure that the layers are tightly combined.

Avoid problems such as bubbles, misalignment or cracking between layers.

Quality Inspection:

Conduct quality inspection after each critical step to ensure that the product meets the standard.

Use professional testing equipment and methods, such as X-ray testing, electrical testing, etc.

Environment and Safety:

Pay attention to environmental protection during the manufacturing process and reduce waste water and exhaust emissions.

Operators should wear protective equipment to ensure safety.

By following the above processes and precautions, high-quality, high-reliability multilayer PCB boards can be manufactured. In the actual manufacturing process, appropriate adjustments and optimizations should also be made according to specific needs and process characteristics.


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