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Microwave PCB

Rogers TC350 High Frequency Circuit Board


Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

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Rogers TC350 and TC600 high frequency circuit board material is the TC series contains glass fiber reinforced and high thermal conductivity ceramic filler PTFE material, can provide better PCB thermal management for applications that require high-power RF signals. The material's low loss, high thermal conductivity, low coefficient of thermal expansion, and excellent temperature phase stability provide excellent performance and reliability in high power applications.

Rogers TC series materials are well suited for applications that are sensitive to changes in dielectric constant (Dk) with temperature, including power amplifiers, filters, couplers, combiners, power dividers, etc.

Rogers TC350 and TC600 high frequency circuit boards offer designers a unique combination of low insertion loss and higher thermal conductivity. This allows the product to have outstanding reliability in high power applications and reduces circuit operating temperatures and improves equipment reliability. TC600 high dielectric constant has the best-in-class thermal conductivity and mechanical properties, which is ideal for power amplifier designers to better realize the reduced size of the finished PCB to reduce the PCB caused by the cost.

Rogers TC350 High Frequency Circuit Board

Rogers TC350 and TC600 Two Material Differences:

a, Rogers TC350 dielectric constant Dk: 3.50 + / - 0.04; loss factor Df: 0.002 (at 10 GHz); thermal expansion XYZ axis coefficient: 7/7/23 (ppm / ℃); thermal conductivity: 0.72W / m - K; fire rating: UL 94V-0

b, Rogers TC600 dielectric constant Dk: 6.15 +/-0.15; loss factor Df: 0.002 (at 10 GHz); thermal expansion XYZ-axis coefficient: 9/9/35 (ppm / ℃); thermal conductivity: 1.0W/m-K; fire rating: UL 94V-0

Rogers TC350, TC600 Has The Following Characteristics.

Advantages:

a, Reduce transmission line loss and heat generation

b, Improve the bandwidth utilization and efficiency of amplifiers and antennas

c, CTE can be matched to low-voltage soldered active components

d, Improved reliability of active element and plated via connections.

Typical Applications:

a, Filters, couplers

b, Combiner, power divider

c, High power RF and microwave power amplifiers

d, High power amplifiers for industrial heating applications

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