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High Precision Circuit Board Manufacturers
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;
Processing Size : 600 * 1200mm ;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers.
The company is equipped with cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.
The company has domestic and imported high-frequency plates all year round, including Rogers, Taconic, Isola, F4B, TP-2, FR4, etc., with complete models.
High Density Interconnect (HDI) PCB represent one of the fastest growing technologies in PCB. Because of their higher circuit density than traditional boards, HDI PCB designs can contain smaller through holes and captured pads, as well as a higher density of connection pads. HDI boards contain blind and buried vias, and often contain microvias with a diameter of 0.006 or less.
By using HDI technology, SMT production designers can now place more components on both sides of the original PCB as needed. Now with the development of through-hole and blind-hole technology in pads, SMT placement factories allow designers to place smaller components closer together. This means faster signal transfer and a significant reduction in signal loss and cross-delay.
HDI PCB are often found in cell phones, touch screen devices, laptops, digital cameras, 4G network communications, and have a significant presence in medical devices.
A. Advantages of HDI PCB
The most common reason for using HDI technology in SMT processing is the significant increase in package density. The space gained from finer track structures can be utilized for components. In addition, the reduction in overall space requirements results in smaller board sizes and fewer layers.
Typically FPGAs or BGAs can provide 1mm or less pitch. HDI technology makes routing and connectivity easy, especially when routing between pins.
B. Improved features of HDI PCB:
- a, Denser trace routing;
- b, More stable power supply;
- c, Reduced interference inductance and capacitance effects;
- d, Improved signal integrity in high-speed designs.
C. Accelerate development with HDI PCB
- a, Easier placement of SMD components;
- b, Faster routing;
- c, Reduced frequent repositioning of components;
- d, More component space (also available via Via-in-Pad).
