Isola PCB Manufacturing
Number of Layers: 4L
Plate Thickness: 1.0mm
Material: lsola High Frequency Plate
Minimum Aperture: 0.3mm
Dielectric Constant: 3.5
Number of Layers: 4L
Substrate Thickness: 0.82mm(32mil)
Product Thickness: 1.8mm
Copper Plating Thickness: 1 oz (35um)
Isola PCB Applications lsola PCB laminates and prepregs are used in different devices and advanced electronics:
New energy vehicles, backplanes, RF/microwave, ai smart devices;
Signal integrity, medical systems, military systems, mobile devices/wireless handsets;
Transportation systems, servers, switches/routers, wireless infrastructure, and more.
What does lsola PCB mean?
The lsola PCB printed circuit board is complex and is manufactured using high performance laminates. It contains resin components designed to meet demanding performance requirements. It is used in most electronic devices such as aerospace equipment and high-end consumer electronics.
A. Types of Materials Used in lsola PCB
There are materials used in the manufacture of lsola PCB. Some of these include
- a, Prepreg
- This term is related to the PCB industry. It is called "prepreg". It is a dielectric material that provides electrical insulation as well as other important functions. It is made from a fiberglass fabric infused with a uniquely formulated resin. The resin and prepreg combine different thermal, electrical and physical properties. This is important for correcting the operation of sola PCB.
- b, Copper Clad Laminate
- This consists of a prepreg laminate with a thin layer of copper foil on both ends. This lamination is achieved by compressing one or more layers of copper and prepreg together under extreme heat, pressure and vacuum conditions.
- c, Constructing Multilayer Isola PCB
- Prepreg and CCL are used to fabricate multilayer Isola PCB through complex operations involving multiple processes that are often repeated. The copper surface of the Changle board is etched. This is done to produce electronic routing, next, the laminate is assembled by inserting one or more layers of prepreg between each etched laminate to form a multilayer structure then plating and drilling holes between the PCB layers to form electrical interconnections. The resulting sola PCB is an interconnecting gadget in which semiconductors and other components are mounted.
B. What materials are used in the resin system of the sola PCB?
sola PCB use a non-flowing prepreg, which is based on polycoolimide and is suitable for PCB applications that require high temperatures. They use polyimide-based resin systems, which are well suited for applications that require superior performance and thermal properties. sola's dips use polyimide blends and thermal resins that can be fully texturized without the use of methylene dianiline (MDA), resulting in polymers with a high Tg that do not suffer from the problems of tireiness and low initial bond strength. As a result, the resin system of lsola PCB is far superior to the resin structure of conventional thermoset polycrystalline polycrystallines.
C. Properties of lsola Prefilled Materials
- a, The following are some of the main characteristics of sola PCB materials.
- b, Maintains bond strength at high temperatures.
- c, Halogen free options available.
- d, Higher thermal performance.
- e, Reduced delamination due to machining.
- f, Improved processability due to reduced brittleness.
- g, Long resin system life.